Multilayer Ceramic Capacitor Electrode Sealing
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in achieving high reliability and uniform capacitance distribution due to issues with electrode connectivity and moisture resistance, particularly when glass is present in external electrode pastes, leading to incomplete sealing and potential delamination between conductive resin and electrode layers.
Innovation Solution
The use of conductive metal electrode layers without glass, featuring uneven surfaces with specific height and distance ratios, ensures efficient sealing and protection of internal electrodes, improving connectivity and reducing equivalent series resistance (ESR) while enhancing moisture resistance and preventing plating solution infiltration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass is added to external electrode paste to improve sealing, then moisture resistance is improved, but delamination occurs between conductive resin and electrode layers
Solution Approach 1:
The patent removes glass from the external electrode paste composition to eliminate the source of delamination. By extracting the harmful component (glass) that causes bonding failure between the conductive resin and electrode layers, the invention resolves the contradiction between moisture resistance and bonding strength.
Solution Approach 2:
The invention changes the compositional parameters of the external electrode paste by eliminating glass and adjusting the ratios of conductive metal powder, binder, and solvent. This parameter change prevents delamination while maintaining sealing effectiveness through alternative mechanisms.
2Quantity of substance
If dielectric layer thickness is decreased to increase capacitance, then capacitance is improved, but manufacturing precision becomes more difficult to maintain
Solution Approach 1:
The patent changes the thickness parameters of dielectric layers and internal electrode layers to achieve higher capacitance in miniaturized components. By optimizing these thickness parameters within controlled ranges, the invention increases capacitance while maintaining manufacturability through precise process control.
Solution Approach 2:
The invention increases the number of laminated dielectric layers to achieve higher capacitance. By segmenting the total capacitance requirement into multiple thinner layers rather than using fewer thicker layers, the patent achieves high capacitance while maintaining better thickness control and manufacturing precision.
3Volume of moving object
If external electrode thickness is decreased to miniaturize component, then size is improved, but connectivity and reliability deteriorate
Solution Approach 1:
The patent segments the external electrode structure into multiple functional layers including an uneven surface layer and a conductive resin layer. This segmentation allows the base electrode layer to be thinner for miniaturization while the conductive resin layer provides enhanced connectivity and reliability, resolving the contradiction between size reduction and connectivity maintenance.
Solution Approach 2:
The invention creates a composite external electrode structure combining metal electrode layers with conductive resin materials. This composite approach enables thinner overall electrode thickness for miniaturization while the conductive resin provides superior electrical connectivity and mechanical bonding, maintaining reliability despite reduced size.
Data Source
AI summary
A multilayer ceramic electronic component is provided including a ceramic body having dielectric layers and a plurality of internal electrodes disposed in the ceramic body. The internal electrodes have exposed portions exposed to the exterior of the ceramic body. An electrode layer is disposed on an outer surface of the ceramic body electrically connected to the exposed portions of the internal electrodes A conductive resin layer is disposed on the electrode layer. The electrode layer has an uneven surface.