Multilayer Ceramic Capacitor Electrode Design for Mounting Stability
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Solution Overview
Problem
Multilayer ceramic electronic components with increased number of stacked layers for high capacitance often have a thickness greater than their width, leading to instability during mounting on printed circuit boards, resulting in frequent toppling and increased defects and short-circuits.
Innovation Solution
A multilayer ceramic electronic component design featuring a ceramic body with a thickness greater than its width, incorporating internal electrodes and external electrodes with head and band parts that are spaced apart, providing stability during mounting and reducing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of stacked layers is increased to achieve high capacitance, then the capacitance is improved, but the thickness becomes greater than the width causing mounting instability
Solution Approach 1:
The external electrodes extend not only on the end surfaces but also on the side surfaces of the ceramic body, utilizing additional dimensional space. This dimensional expansion of the electrode structure provides extended contact areas that improve mounting stability without altering the core capacitance-determining stacked layer configuration.
Solution Approach 2:
The external electrodes are pre-formed on specific surfaces (end surfaces and side surfaces) before mounting, creating a stable mounting interface in advance. This preliminary formation of electrode structures on multiple surfaces ensures that when the component is mounted, the electrodes are already positioned to provide optimal stability and electrical connection.
2Quantity of substance
If the thickness is increased to achieve high capacitance through more stacked layers, then the capacitance is improved, but the component topology changes causing frequent toppling
Solution Approach 1:
The external electrodes utilize both end surfaces and side surfaces of the ceramic body, effectively using three-dimensional space for electrode placement. This multi-surface electrode configuration allows the component to maintain its high-capacitance thick structure while achieving stable mounting through extended electrode contact on multiple faces.
Solution Approach 2:
The external electrodes are asymmetrically distributed across different surfaces of the ceramic body, with head parts on end surfaces and band parts on side surfaces. This asymmetric electrode arrangement creates a stable mounting configuration that prevents toppling, while allowing the ceramic body to maintain its high-capacitance thick structure.
3Quantity of substance
If the number of stacked layers is increased, then the capacitance is improved, but the external electrode surface becomes rounded and convex increasing defects
Solution Approach 1:
The external electrodes extend onto the side surfaces of the ceramic body in addition to the end surfaces. This dimensional extension provides flat mounting surfaces on the side surfaces, eliminating the problem of rounded convex surfaces on the end surfaces and enabling precise mounting without defects.
Data Source
AI summary
There is provided a multilayer ceramic electronic component including a ceramic body including a plurality of dielectric layers stacked in a thickness direction and satisfying T/W>1.0 when it is defined that a width thereof is W and a thickness thereof is T, a plurality of first and second internal electrodes disposed in the ceramic body so as to face each other, having the dielectric layer interposed therebetween, and alternately exposed through both end surfaces of the ceramic body, and first and second external electrodes including head parts formed on both end surfaces of the ceramic body and two band parts connected to the head parts and formed on portions of upper and lower main surfaces of the ceramic body so as to be spaced apart from each other in a width direction, and electrically connected to the first and second internal electrodes, respectively.