Multilayer Ceramic Capacitor Electrode Stress Relief
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in withstanding impact and thermal stress, leading to cracking and increased equivalent series resistance (ESR) due to inadequate stress relief and high contact resistance between thermosetting resin and Ni plating layers.
Innovation Solution
A multilayer ceramic electronic component design featuring conductive resin layers that cover only a portion of the underlying electrode layers on the end surfaces, allowing for stress relief and reduced ESR through controlled separation, while maintaining low contact resistance with substrates using Cu or Ag powders and plating layers to prevent corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an epoxy-based thermosetting resin layer is located between the underlying electrode layer and Ni plating layer, then the multilayer body is protected from cracking under impact and thermal stress, but the contact resistance between the resin layer and Ni plating layer increases, resulting in increased ESR
Solution Approach 1:
The outer electrode is segmented into three distinct layers: underlying electrode layer, conductive resin layer, and plating layer. This segmentation allows each layer to perform its specialized function - the underlying electrode provides structural support and stress relief, the conductive resin reduces contact resistance, and the plating layer prevents corrosion, thereby resolving the contradiction between crack resistance and low contact resistance
Solution Approach 2:
The outer electrode uses a composite structure combining different materials with complementary properties: the underlying electrode layer (metallic for conductivity), the conductive resin layer (epoxy-based for stress absorption and low contact resistance), and the plating layer (Ni or alloy for corrosion resistance). This composite approach enables the system to achieve both crack resistance and low ESR simultaneously
2Reliability
If the conductive resin layer covers the entire underlying electrode layer, then stress relief is maximized, but the contact resistance and ESR increase significantly
Solution Approach 1:
The conductive resin layer is applied selectively to specific regions of the underlying electrode layer rather than covering the entire surface. This local application strategy ensures stress relief is provided where most needed (at the interface with the multilayer body) while minimizing the resin's presence in areas where it would increase contact resistance, thereby balancing stress relief capability with low ESR
Solution Approach 2:
Instead of applying the conductive resin layer uniformly across the entire underlying electrode, the invention uses partial coverage where the resin is applied only to the extent necessary for stress relief. This partial action approach provides sufficient stress relief functionality while avoiding excessive resin that would increase contact resistance and ESR
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces the formation of cracks and ESR in multilayer ceramic capacitors under extreme stress conditions, enhancing their durability and performance.
Implementation Method 1
the stress that propagates through the mounting substrate (deformation of the mounting substrate) is released by causing separation between the underlying electrode layer and the epoxy-based thermosetting resin layer
Implementation Method 2
The first conductive resin layer and the second conductive resin layer each include a thermosetting resin and a metal component
Implementation Method 3
plating layers to prevent corrosion
Data Source
AI summary
A multilayer ceramic electronic component includes a multilayer body that includes a second main surface defining and functioning as a mounting surface. Outer electrodes include underlying electrode layers including a conductive metal and a glass component and conductive resin layers including a thermosetting resin and a metal component. The underlying electrode layers extend from first and second end surfaces onto at least the second main surface. The conductive resin layers extend onto the underlying electrode layers provided on the second main surface, portions of the second main surface, and portions of the underlying electrode layers provided on the first end surface and the second end surface and cover portions of the first and second end surfaces, the portions including areas corresponding to about 9% or more and about 82% or less of areas of the first and the second end surfaces.