Ceramic Capacitor Electrode Structure for Low-Height Strength Retention
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Solution Overview
Problem
The challenge is to reduce the height of multilayer ceramic capacitors without compromising their transverse rupture strength and causing breakage of external electrodes, which is exacerbated by thinning the element body, leading to weak adhesion and conductive issues with terminal electrodes.
Innovation Solution
A ceramic electronic component design featuring an element body with external electrodes formed on its surfaces, including a base layer and plating layer, where the base layer is in contact with internal electrodes, and the plating layer extends along the periphery, forming a multilayer structure, while avoiding coverage on the upper surface to maintain strength and adhesion, and using a substrate arrangement with solder layers and resin for mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the element body is thinned to reduce height, then the height of the multilayer ceramic capacitor is reduced, but the transverse rupture strength drops and the element body may crack during mounting
Solution Approach 1:
The external electrodes are configured to extend along the peripheral portion of the element body in a manner that provides mechanical reinforcement. The base layer contacts the internal electrode while the plating layer extends along the periphery, creating a strengthened structure that resists cracking during mounting while maintaining reduced height.
2Length of moving object
If terminal electrodes are not formed on the lower surface to reduce height, then the height is reduced, but the element bodies become very weak and difficult to separate in a desired manner
Solution Approach 1:
Instead of forming terminal electrodes on the lower surface, the external electrodes are configured to extend along the peripheral portion of the element body, providing mechanical reinforcement in a different spatial arrangement that maintains strength while enabling proper separation.
3Length of moving object
If the element body is thinned, then the height is reduced, but the adhesion of terminal electrodes to the element body deteriorates
Solution Approach 1:
The external electrodes are reconfigured to extend along the peripheral portion of the element body rather than being formed on the lower surface. This dimensional change maintains strong adhesion between the base layer and internal electrode while preserving the reduced height profile.
4Length of moving object
If terminal electrodes are broken with rough fractured surfaces, then the height may be reduced, but the conductive contact between electrode portions and terminal electrodes is lost, resulting in thin and non-uniform plating layers
Solution Approach 1:
The external electrodes are configured to extend along the peripheral portion of the element body, ensuring that the base layer maintains intact contact with the internal electrode. This configuration prevents electrode breakage and ensures uniform plating layer formation while maintaining reduced height.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for reduced height without decreasing transverse rupture strength, ensuring robust adhesion and conductivity, and preventing external electrode breakage, thereby enhancing the reliability and stability of the ceramic electronic component.
Implementation Method 1
When electroplating is applied to the terminal electrodes, plating is deposited on the assumption that the electrode portions of the element body are electrically in contact with the terminal electrodes.
Data Source
AI summary
A ceramic electronic component includes an element body and at least one external electrode formed on the element body. The element body includes a dielectric and at least one internal electrode therein. The element body has a plurality of surfaces, and these surfaces include a first surface and a second surface opposite the first surface. Each external electrode includes a base layer and a plating layer formed on the base layer. The base layer is in contact with the internal electrode, contains a metal, and has a first end face adjacent to an outer periphery of the second surface of the element body. The plating layer has a second end face adjacent to an outer periphery of the first end face such that the first and second end faces form, in combination, a multilayer structure on the outer periphery of the second surface of the element body.