Multilayer Ceramic Capacitor Electrode Thickness Control
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Solution Overview
Problem
Multilayer ceramic capacitors face reliability issues due to low bonding force between metal and ceramic interfaces, leading to delamination and cracking, which deteriorate moisture resistance, especially with the miniaturization of components where dielectric and internal electrode thicknesses are reduced.
Innovation Solution
The solution involves adjusting the standard deviation of internal electrode thicknesses to a specific ratio relative to the dielectric layer thickness (0.12≤σte/td≤0.21) to enhance interfacial bonding and improve moisture resistance reliability while maintaining excellent withstand voltage characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thicknesses of the dielectric layer and internal electrode layer are reduced to achieve miniaturization and high capacity, then the component size is reduced and capacity is increased, but the bonding force between metal and ceramic interfaces decreases leading to delamination and cracking
Solution Approach 1:
The patent controls the standard deviation of internal electrode thickness (σte) relative to dielectric layer thickness (td) within a specific range (0.10 ≤ σte/td < 0.30). This parameter control ensures adequate bonding area between metal and ceramic interfaces even when overall dimensions are reduced, preventing delamination and cracking while achieving miniaturization and high capacity
2Quantity of substance
If the thickness of the dielectric layer is reduced to increase the contact ratio, then the component capacity is increased, but the bonding force at the metal-ceramic interface decreases making it vulnerable to delamination and cracking
Solution Approach 1:
The patent establishes a specific range for the ratio of standard deviation of internal electrode thickness to dielectric layer thickness (0.10 ≤ σte/td < 0.30). This parameter optimization ensures that even with reduced dielectric layer thickness, the internal electrode maintains sufficient bonding contact area, thereby preserving moisture resistance reliability while achieving high capacity
3Quantity of substance
If the thickness of the dielectric layer and internal electrode layer are reduced, then the component size is reduced and capacity is increased, but the bonding force between metal and ceramic interfaces decreases leading to delamination and cracking
Solution Approach 1:
The patent controls the standard deviation of internal electrode thickness (σte) relative to dielectric layer thickness (td) within a specific range (0.10 ≤ σte/td < 0.30). This parameter control ensures adequate bonding area between metal and ceramic interfaces even when overall dimensions are reduced, preventing delamination and cracking while achieving miniaturization and high capacity
Data Source
AI summary
A multilayer ceramic electronic component includes a ceramic body including first and second internal electrodes disposed to face each other and a dielectric layer interposed therebetween. When an average thickness of the dielectric layer is denoted as ‘td,’ an average thickness of the first and second internal electrodes is denoted as ‘te,’ and a standard deviation of thicknesses of an internal electrode, measured at a plurality of points in a predetermined region of the internal electrode, is denoted as ‘σte,’ a ratio of the standard deviation of thicknesses of the internal electrode to the average thickness of the dielectric layer, which is denoted as ‘σte/td,’ satisfies 0.12≤σte/td≤0.21.