Multilayer Ceramic Capacitor Interposer with Double-Layer Terminals
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Solution Overview
Problem
Multilayer ceramic capacitors generate acoustic noise due to piezoelectric vibrations when mounted on printed circuit boards, causing discomfort through audible frequencies.
Innovation Solution
A multilayer ceramic electronic component is designed with a multilayer ceramic capacitor and an interposer substrate, where the capacitor has external electrodes formed of conductive paste and the interposer substrate has connection terminals with a double-layer structure, including conductive resin layers and plating layers, to reduce acoustic noise by alleviating stress and vibrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a multilayer ceramic capacitor is mounted directly on a printed circuit board, then ease of mounting is improved, but acoustic noise is generated due to piezoelectric vibrations
Solution Approach 1:
An interposer substrate is introduced as an intermediary component between the multilayer ceramic capacitor and the printed circuit board. This interposer substrate includes connection terminals with a double-layer structure (conductive resin layer and plating layer) that connects to the external electrodes of the capacitor, thereby mediating the connection and reducing direct stress transfer that causes acoustic noise while maintaining ease of mounting
2Ease of manufacture
If external electrodes are formed directly on the ceramic body, then manufacturing simplicity is improved, but stress concentration occurs leading to acoustic noise
Solution Approach 1:
The connection terminals are constructed using composite materials with a double-layer structure: a conductive resin layer providing mechanical compliance and stress distribution, and a plating layer providing electrical conductivity and solderability. This composite structure reduces stress concentration on the ceramic body while maintaining manufacturing feasibility through standard coating processes
3Device complexity
If a simple single-layer terminal structure is used, then device complexity is reduced, but acoustic noise reduction effectiveness is insufficient
Solution Approach 1:
A double-layer terminal structure is employed where the conductive resin layer absorbs and distributes piezoelectric stress, and the plating layer provides electrical connection. This composite structure effectively reduces acoustic noise by decoupling the mechanical stress path from the electrical connection path, while the layered configuration remains compatible with standard manufacturing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces acoustic noise by preventing direct transfer of piezoelectric stress from the capacitor to the circuit board, resulting in lower noise levels and reduced deviation in noise measurements.
Implementation Method 1
first and second connection terminals connected to the first and second external electrodes at both ends of an insulation substrate, respectively, the first and second connection terminals having a double-layer structure including first and second conductive resin layers and first and second plating layers
Implementation Method 2
Since the dielectric layers have piezoelectric and electrostrictive properties, a piezoelectric phenomenon may occur and thus cause vibrations between the internal electrodes when AC or DC voltage is applied to the multilayer ceramic capacitor
Implementation Method 3
an interposer substrate attached to a mounting surface of the multilayer ceramic capacitor and including first and second connection terminals connected to the first and second external electrodes... to reduce acoustic noise by alleviating stress and vibrations
Data Source
AI summary
A multilayer ceramic electronic component includes a multilayer ceramic capacitor and an interposer substrate. The multilayer ceramic capacitor includes first and second external electrodes formed of a conductive paste on both ends of a ceramic body. The interposer substrate is attached to a mounting surface of the multilayer ceramic capacitor and includes first and second connection terminals connected to the first and second external electrodes at both ends of an insulation substrate, respectively. The first and second connection terminals have a double-layer structure including first and second conductive resin layers and first and second plating layers formed on the first and second conductive resin layers.