Multilayer Ceramic Capacitor Electrode Structure for Low-ESR Bonding
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Solution Overview
Problem
Multilayer ceramic capacitors face issues with external electrode peeling due to mechanical stress, and existing solutions that improve bonding strength, such as using a glass component layer, increase the equivalent series resistance (ESR).
Innovation Solution
A multilayer ceramic electronic component design featuring a multilayer body with ceramic layers containing Ca and Zr, internal electrode layers, and external electrode layers with a base electrode layer and plated layer, including Cu as a main component, where the edge portions have compound regions that enhance bonding without increasing ESR.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a glass component layer is provided between the multilayer chip and external electrode to improve bonding strength, then the bonding strength between multilayer chip and external electrode is improved, but the equivalent series resistance (ESR) of the multilayer ceramic capacitor increases due to the insulating property of glass
Solution Approach 1:
The patent applies local quality by creating a compound region only at the edge portions of the multilayer body where the base electrode layer contacts the multilayer body, rather than using a glass component layer throughout. This localized approach provides bonding enhancement precisely where mechanical stress concentrates at the edges, while leaving the central regions free to maintain low ESR electrical pathways.
Solution Approach 2:
The patent uses composite materials by forming a compound region that integrates the base electrode layer material with ceramic layer material at the edge portions. This composite structure creates a gradient transition zone that enhances bonding strength through material interdiffusion and mechanical interlocking, while the Cu-based base electrode layer maintains its conductive properties.
2Volume of moving object
If the dimensions of electronic components are reduced for miniaturization, then the size of electronic devices is reduced, but the external electrodes become more susceptible to peeling under mechanical stress
Solution Approach 1:
The patent addresses the size reduction challenge by concentrating bonding enhancement measures at the critical edge portions where peeling initiates, rather than uniformly thickening the entire electrode structure. This allows miniaturization to proceed while maintaining bonding strength at the most vulnerable locations.
Solution Approach 2:
The patent applies preliminary action by forming the compound region at the edge portions before final assembly, creating a pre-strengthened bonding interface. This preliminary bonding enhancement prepares the structure to withstand subsequent mechanical stresses that occur during mounting and operation, preventing peeling in miniaturized components.
Data Source
AI summary
A multilayer ceramic electronic component includes ceramic layers including Ca and Zr as main components, first and second external electrodes including a first base electrode layer and second base electrode layer, and a plated layer covering a portion of the first and second base electrode layers, the first and second base electrode layers include Cu as a main component, a multilayer body includes at an edge portion in a lamination direction a first compound region extending to a first end surface and a second compound region extending to the second end surface, the first compound region is joined with the first base electrode layer, the second compound region is joined with the second base electrode layer, and the first compound region and second compound region are not joined to each other.