Ceramic Capacitor Dielectric Composition for Margin Density Control
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Solution Overview
Problem
The miniaturization of ceramic electronic components leads to reliability issues due to sintering mismatching and reduced density in the margin portion, causing accelerated lifespan reduction and compromised moisture resistance.
Innovation Solution
The use of different dielectric compositions for the active and margin portions, with the active portion containing tin (Sn) and dysprosium (Dy) and the margin portion containing magnesium (Mg), both based on a barium titanate material, to reduce sintering mismatching and increase density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If heavy reduction and high-temperature uniaxial sintering conditions are applied for miniaturization, then the size of the ceramic electronic component is reduced, but sintering mismatching occurs between active portion and margin portion and density of the margin portion is reduced
Solution Approach 1:
The patent applies different dielectric compositions to different regions of the ceramic electronic component. The active portion contains a first dielectric composition optimized for capacitance, while the margin portion contains a second dielectric composition specifically designed to match the sintering behavior of the internal electrodes. This local differentiation ensures uniform sintering shrinkage across the entire component, eliminating sintering mismatching and maintaining high density in the margin portion even under heavy reduction conditions.
2Volume of moving object
If the dielectric layer is thinned for miniaturization, then the component size is reduced, but moisture resistance reliability deteriorates
Solution Approach 1:
The patent implements a localized composition strategy where the margin portion dielectric is specifically engineered with different compositional characteristics compared to the active portion. This localized optimization allows the margin portion to provide enhanced protective function against moisture ingress while the active portion maintains its thin-profile design for miniaturization and high capacitance density.
3Volume of moving object
If high-temperature sintering is applied for miniaturization, then the component size is reduced, but accelerated lifespan decreases due to sintering behavior difference
Solution Approach 1:
The patent modifies the compositional parameters of the dielectric material in the margin portion to achieve sintering behavior compatibility with the internal electrodes. By adjusting the dielectric composition specifically in the margin portion, the sintering temperature, shrinkage rate, and densification characteristics are optimized to match the electrode behavior, thereby preventing interfacial defects and extending component lifespan under high-temperature sintering conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves the reliability of ceramic electronic components by enhancing the density and moisture resistance of the margin portion, while maintaining high capacitance and miniaturization.
Implementation Method 1
as heavy reduction and high-temperature uniaxial sintering conditions are applied, mismatching between an active portion and a margin portion may occur due to a sintering behavior difference
Data Source
AI summary
A ceramic electronic component includes: a body including an active portion, including a first dielectric layer and an internal electrode, and a margin portion disposed a side surface of the active portion and including a second dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. The first and second dielectric layers have different dielectric compositions. The first dielectric layer includes tin (Sn) and dysprosium (Dy). The second dielectric layer includes magnesium (Mg).