Multilayer Ceramic Capacitor Moisture Barrier Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Thin multilayer ceramic electronic components, such as capacitors and inductors, face challenges in preventing moisture intrusion, which can lead to corrosion and functional failures due to the reduced thickness of dielectric margin parts, making it essential to develop structures that effectively barrier moisture.
Innovation Solution
The implementation of a multilayer ceramic electronic component design featuring external electrodes with insulative layers on specific faces of the component body, which are partially covered by the electrodes, helps to prevent moisture intrusion by creating a barrier, even when the component is made thin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of dielectric margin parts is reduced to achieve thin multilayer ceramic electronic components, then the component thickness is reduced, but moisture intrusion resistance deteriorates
Solution Approach 1:
The patent applies preliminary action by forming insulative layers on the dielectric margin parts before final assembly. These insulative layers are pre-formed to prevent moisture intrusion pathways, addressing the moisture resistance issue before the component is fully assembled and put into service. This allows thin dielectric margin parts to be used without compromising moisture resistance.
Solution Approach 2:
The patent introduces insulative layers as intermediary materials between the dielectric margin parts and the external environment (moisture). These insulative layers act as a mediator that blocks moisture pathways while allowing the dielectric margin parts to maintain their reduced thickness. The insulative layers are formed on specific surfaces to create a protective barrier without adding significant thickness to the component.
2Length of moving object
If the thickness of dielectric margin parts is reduced to achieve thin multilayer ceramic electronic components, then the component thickness is reduced, but structural strength deteriorates
Solution Approach 1:
The patent applies composite materials by combining the dielectric material with insulative materials in a layered structure. The dielectric margin parts maintain their thin thickness while the insulative layers provide additional structural support and strength. This composite structure allows the component to be thin while maintaining adequate mechanical strength through the combined properties of different materials.
Data Source
AI summary
In an exemplary embodiment, in a multilayer ceramic capacitor 10, a first insulative layer 13-1 having parts A1, A2 covered by the first part 12b of each external electrode 12 is provided on one third-direction face, while a second insulative layer 13-2 having parts A3, A4 covered by the second part 12c of each external electrode 12 is provided on the other third-direction face, of the capacitor body 11 of the multilayer ceramic capacitor 10. The multilayer ceramic electronic component can prevent moisture intrusion into the component body as much as possible, even when the multilayer ceramic electronic component is made thin.