Multiterminal Ceramic Capacitor Filter for PCB Space Saving
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Solution Overview
Problem
Existing electronic components face challenges in miniaturization and increased functionality, particularly in multilayer ceramic devices like capacitors and varistors, which occupy significant space on circuit boards and limit integration possibilities.
Innovation Solution
A multiterminal multilayer ceramic device is developed, integrating multiple capacitive elements in a single package through specific electrode layer constructions and terminations, allowing for series and parallel connections, and optionally incorporating a discrete varistor for enhanced functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple discrete capacitor components are used to achieve desired capacitance values and configurations, then the required capacitance performance is achieved, but the device occupies significant space on the circuit board
Solution Approach 1:
The patent combines multiple discrete capacitor components into a single integrated multilayer ceramic device. The device includes multiple capacitor elements with different capacitance values (e.g., first capacitor with first capacitance value, second capacitor with second capacitance value) formed within one ceramic body, eliminating the need for multiple separate components and reducing circuit board space occupation.
Solution Approach 2:
The integrated device provides multiple functions within a single component. It includes capacitors with different capacitance values that can be connected in various configurations (series, parallel, or independent), allowing the single device to replace multiple discrete capacitors and provide versatile electrical functionality while minimizing space usage.
2Quantity of substance
If multiple discrete capacitor components are used to achieve desired capacitance configurations, then the required electrical performance is achieved, but the overall device size increases
Solution Approach 1:
The patent implements a nested structure where multiple capacitor elements are embedded within a single ceramic body. The capacitors are formed by stacking dielectric layers and electrode layers in a multilayer configuration, with each capacitor element nested within the same physical housing, thereby minimizing the overall device volume while accommodating multiple capacitance values.
3Reliability
If multiple discrete components are replaced with a single integrated device, then space is saved and reliability is improved, but the device complexity increases
Solution Approach 1:
The patent divides the internal structure into distinct functional regions within the ceramic body. Each capacitor element is formed by specific combinations of dielectric layers and electrode layers, with terminations provided for each capacitor element. This segmentation allows independent control and connection of each capacitor while maintaining a unified external package, balancing complexity management with reliability improvement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in reduced device size, lower parasitic inductance, and EMI/ESD protection, enabling space-saving integration and improved reliability by replacing multiple discrete components with a single integrated device.
Implementation Method 1
a first region of the electrode layers forming a split feedthrough type construction of two respective capacitors; a second region of the electrode layers forming an overlap type construction of a multilayer ceramic capacitor
Data Source
Figure 1A~1B
Figure 1C~1D
Figure 2
AI summary
Disclosed are apparatus and a method for providing an integrated multi-terminal multilayer ceramic device that has three or more capacitive elements. Two of such capacitive elements may be in series, with a third in parallel. The integrated device may be packaged as an overmolded three leaded component, or can be mounted as SMD (surface mount device). The integrated device may also be combined with a separate varistor in a stacked arrangement of leaded components.