Laminated Ceramic Capacitor Planar Connecting Area
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Laminated ceramic electronic components face challenges in connection reliability due to marked height gaps and undulations on the top surfaces of external electrodes, which can lead to connection failures with conductor pads and vias.
Innovation Solution
A laminated ceramic electronic component design featuring a concaved part along the edges of the component body, with a base conductor layer and a main conductor layer that form a planar connecting area, eliminating height gaps and undulations for improved connection reliability with conductor pads and vias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If extended parts and wrap-around parts are formed underneath the metal films, then the external electrodes can be formed on the component body, but marked height gaps and undulations form on the top surfaces of the metal films, deteriorating connection reliability
Solution Approach 1:
The invention introduces a planar connecting area with flat surface properties specifically at the connection location, while other parts of the external electrode can maintain their wrap-around structure. This local application of flatness resolves the contradiction by providing the necessary surface quality for reliable connections without eliminating the functional benefits of the wrap-around design elsewhere.
Solution Approach 2:
The invention adds a new structural dimension by creating a planar connecting area that extends from the wrap-around parts, effectively adding a flat surface dimension to the otherwise three-dimensional wrap-around structure. This dimensional addition provides a reliable connection surface while maintaining the vertical wrap-around configuration for electrical connection.
2Adaptability or versatility
If the top surfaces of metal films have marked height gaps and undulations, then the external electrode structure can accommodate the component body shape, but the clearances between top surfaces and conductor pads become uneven, causing solder distribution issues
Solution Approach 1:
The planar connecting area provides a localized flat surface specifically at the connection region, ensuring uniform clearance and solder distribution where it matters most for manufacturing precision, while the rest of the external electrode maintains its adaptability to the component body shape through the wrap-around structure.
3Adaptability or versatility
If the top surfaces of metal films have marked height gaps and undulations, then the external electrode structure can follow the component body contours, but the usable area for connection with conductor vias is reduced
Solution Approach 1:
The invention creates a dedicated planar connecting area with sufficient flat surface area specifically for conductor via connections, ensuring adequate connection area where needed, while the wrap-around parts maintain the contour-following capability for adapting to the component body shape.
Solution Approach 2:
By adding the planar connecting area as an extended flat surface from the wrap-around structure, the invention increases the usable connection area in the horizontal dimension while maintaining the vertical wrap-around configuration for contour adaptation.
Data Source
AI summary
A laminated ceramic capacitor has a capacitor body of roughly a rectangular solid shape defined by the length, width, and height, as well as a concaved part formed at and along the edges of one side and the other side in the height direction. An external electrode has a base conductor layer whose height-direction wrap-around part is formed inside the concaved part, and a main conductor layer whose height-direction wrap-around part is formed continuously over the height-direction wrap-around part of the base conductor layer through the planar part, except for the concaved part, of one side and the other side of the component body in the height direction. The height-direction wrap-around part of the main conductor layer has a planar connecting area constituted by a surface area over the height-direction wrap-around part of the base conductor layer and a surface area over the planar part of the component body.