Multilayer Ceramic Capacitor Recessed Electrode Adhesion

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Solution Overview

Problem

Multilayer ceramic electronic components face issues with low adhesive force between the conductive resin electrode layer and the sintered electrode layer, leading to separation and reduced resistance to substrate deflection.

Innovation Solution

The component features a ceramic element body with external electrodes comprising a sintered metal layer, a conductive resin layer with recesses for enhanced adhesion, and a plating layer, where the conductive resin layer includes a mixture of Cu or Ag powder particles and resin, and the plating layer has projections to improve anchoring and adhesion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a conductive resin electrode layer containing a large amount of resin is used, then the resistance to deflection of substrate is improved, but the adhesive force between the conductive resin electrode layer and the sintered electrode layer deteriorates

Engineering Contradiction:
Improveresistance to deflection of substrateVSAvoidadhesive force between conductive resin electrode layer and sintered electrode layer
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The sintered electrode layer is designed with a porous structure containing multiple voids that penetrate through the layer. These voids allow the conductive resin electrode layer to mechanically interlock with the sintered electrode layer, significantly improving adhesive force while maintaining the high resin content necessary for substrate deflection resistance.

Inventive Principle:
Principle #31Porous materials

Solution Approach 2:

The conductive resin electrode layer is positioned to surround and enclose the porous structure of the sintered electrode layer. This nested configuration allows the resin-rich outer layer to provide mechanical strength against substrate deflection while the inner porous structure maintains strong adhesion to the sintered electrode layer.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Strength

If the conductive resin electrode layer has high resin content, then the resistance to substrate deflection is improved, but separation between the conductive resin electrode layer and the sintered electrode layer occurs

Engineering Contradiction:
Improveresistance to substrate deflectionVSAvoidseparation between conductive resin electrode layer and sintered electrode layer
Core Design Contradiction:
StrengthVSStability of the object's composition

Solution Approach 1:

The porous structure of the sintered electrode layer with penetrating voids creates a mechanical interlocking effect that prevents separation between layers. The conductive resin fills and bonds within these voids, forming a stable composite structure that maintains integrity under substrate deflection stresses.

Inventive Principle:
Principle #31Porous materials

Solution Approach 2:

The electrode structure is designed as a composite system combining the sintered electrode layer with porous structure and the conductive resin electrode layer. This composite construction leverages the complementary properties of both materials to achieve both high adhesion and resistance to separation under mechanical stress.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS8988854B1Multilayer ceramic electronic component
Publication Date: 2015.03.24 MURATA MFG CO LTD
  • US8988854B1 patent drawing
  • US8988854B1 patent drawing
  • US8988854B1 patent drawing

AI summary

A multilayer ceramic capacitor includes a ceramic element body including internal electrodes therein. External electrodes are provided on end surfaces of the ceramic element body and electrically connected to exposed portions of respective ones of the internal electrodes. Each of the external electrodes includes a sintered metal layer, a conductive resin layer, and a plating layer. In a cross section of the multilayer ceramic capacitor, at an interface between the sintered metal layer and the conductive resin layer, recesses having a shape in which a dimension of an inner portion is larger than a dimension of an inlet are present, and a number of recesses in which a material of the conductive resin layer is present is 2 or more within a length range of about 70 μm along the interface.