Multilayer Ceramic Capacitor External Electrode Resin Buffer
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in withstanding drop impact and thermal cycling, as existing solutions like epoxy thermosetting conductive resin layers increase equivalent series resistance (ESR) while providing limited protection against cracking.
Innovation Solution
A multilayer ceramic electronic component design featuring external electrodes with a resin layer containing no metal component, which reduces ESR and acts as a buffer to absorb stresses, preventing cracking under mechanical and thermal stresses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an epoxy thermosetting conductive resin layer containing metallic powder is used for external electrodes, then resistance to cracking is improved, but equivalent series resistance (ESR) increases
Solution Approach 1:
The patent extracts the metallic powder component from the resin layer, transitioning from a conductive resin containing metal particles to a non-conductive resin without metal. This removal eliminates the harmful effect of increased ESR while preserving the stress-absorbing function of the resin layer through its peeling mechanism.
Solution Approach 2:
Instead of using a conductive resin that provides both electrical conductivity and stress protection, the invention inverts the approach by using a non-conductive resin that provides stress protection through a different mechanism (peeling off under stress) rather than maintaining conductivity under stress.
2Loss of energy
If a resin layer containing no metal component is used, then equivalent series resistance (ESR) is reduced, but resistance to cracking may be compromised
Solution Approach 1:
The non-conductive resin layer acts as a pre-positioned cushioning layer that peels off beforehand under applied stress, absorbing the mechanical strain before it can reach the capacitor body. This peeling mechanism provides stress protection without requiring metallic components, thus maintaining low ESR while preventing cracking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves reduced ESR and enhanced resistance to cracking, ensuring the capacitor's reliability in harsh environments by eliminating metal components in the resin layer and utilizing a thermosetting resin as a stress buffer.
Implementation Method 1
the resin layer... acts as a buffer to absorb stresses, preventing cracking under mechanical and thermal stresses
Implementation Method 2
bending stresses due to the thermal expansion and contraction of a mounting board caused by thermal cycling
Data Source
AI summary
A multilayer ceramic electronic component includes a stacked body, and an external electrode including an underlying electrode layer containing a conductive metal and a glass component, a resin layer containing a thermosetting resin and no metal component, and a plating layer. The underlying electrode layer extends from a first or second end surface, and covers a portion of each of first and second main surfaces and first and second lateral surfaces. The resin layer covers the underlying electrode layer on the second main surface adjacent to the first or second end surface. The plating layer covers a portion of the surface of the underlying electrode layer that is not covered with the resin layer, and covers the surface of the resin layer.