Ceramic Capacitor External Electrode Resin Thickness Optimization
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in achieving high flexural strength and low equivalent series resistance (ESR) due to the high resistance of conductive resin layers, which affect their reliability, especially in mechanical and thermal stress environments.
Innovation Solution
A ceramic electronic component design featuring a body with a dielectric layer and internal electrodes, where the thickness of the conductive resin layers on external electrodes is optimized such that tb is less than 80 μm and (ta+tb)/L*50 is 1 or greater, improving flexural strength and reducing ESR.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive resin layer is applied to the external electrode to prevent cracks and absorb stress, then reliability is improved, but equivalent series resistance (ESR) increases
Solution Approach 1:
The patent changes the thickness parameter of the conductive resin layer to less than 80 μm and optimizes the ratio (ta+tb)/L*50 to be 1 or greater, where ta is electrode layer thickness, tb is conductive resin layer thickness, and L is the distance between third and fourth surfaces. This parameter optimization reduces the resistance of the conductive resin layer while maintaining its stress-absorbing function, thereby reducing ESR while preserving reliability.
2Strength
If the thickness of the conductive resin layer is increased to improve stress absorption, then flexural strength is improved, but equivalent series resistance increases
Solution Approach 1:
The patent identifies and optimizes critical thickness parameters: the conductive resin layer thickness tb is controlled to be less than 80 μm, and the ratio (ta+tb)/L*50 is set to 1 or greater. This parameter optimization achieves the balance where sufficient thickness maintains flexural strength and stress absorption capability, while controlled thickness minimizes resistance and ESR.
Solution Approach 2:
The patent applies partial action by using a conductive resin layer thickness that is sufficient to provide stress absorption and flexural strength (tb < 80 μm and (ta+tb)/L*50 ≥ 1), but not excessive. This optimized thickness provides just enough mechanical protection while minimizing the harmful electrical resistance effect, avoiding the need for excessive thickness that would unnecessarily increase ESR.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optimized design enhances flexural strength and reduces equivalent series resistance, thereby improving the reliability of ceramic electronic components by effectively absorbing stress and maintaining low ESR.
Implementation Method 1
a technique of applying a conductive resin layer to an external electrode has been used to prevent cracks caused by stress by absorbing tensile stress occurring in a mechanical or thermal environment
Implementation Method 2
A conductive resin layer may electrically and mechanically connect a sintered electrode layer and a plating layer of an external electrode
Data Source
AI summary
A ceramic electronic component includes a body including a dielectric layer, and a first internal electrode and a second internal electrode opposing each other with the dielectric layer interposed therebetween, and having first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other, a first external electrode including a first electrode layer connected to the first internal electrode, and a first conductive resin layer disposed on the first electrode layer, and disposed on the third surface of the body, and a second external electrode including a second electrode layer connected to the second internal electrode, and a second conductive resin layer disposed on the second electrode layer, and disposed on the fourth surface of the body.