Multilayer Ceramic Capacitor Series Layout for High-Voltage Withstand
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Solution Overview
Problem
Existing multi-layer chip ceramic dielectric capacitors struggle to meet high operating voltage requirements and suffer from uneven electric field distribution leading to arcing discharge and potential burning under high voltage conditions.
Innovation Solution
A multi-layer chip ceramic dielectric capacitor design with evenly distributed internal electrodes and external connections, ensuring identical gaps and alternating electrode layers, allowing for series connection of equal capacitance components to withstand higher voltages by voltage division.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a parallel structure of multiple layers of parallel-plate capacitors is used, then the capacitor is suitable for use under low operating voltage conditions, but it cannot meet the requirements of high operating voltage
Solution Approach 1:
The capacitor is divided into multiple series-connected capacitor units (first, second, third, and fourth capacitor units) within the internal structure. Each unit consists of specific electrode layers and dielectric layers arranged in series, allowing the total breakdown voltage to be the sum of individual unit voltages. This segmentation enables high voltage capability while maintaining a compact multi-layer structure.
Solution Approach 2:
The patent transitions from a conventional parallel structure to a series structure by rearranging the connection topology of electrode layers in the third dimension (vertical stacking direction). Internal electrodes are configured to form series connections through alternating positive and negative polarity layers, achieving high voltage capability without increasing planar area.
2Reliability
If an apparatus using a series structure to increase breakdown voltage is used, then the breakdown voltage can be increased, but the increase is restricted due to internal configuration problems
Solution Approach 1:
Different regions of the capacitor have different electrode configurations optimized for their specific functions. The first and second electrode layers have different patterns from the third and fourth electrode layers, with specific electrode gaps and overlapping areas designed to create uniform electric field distribution in each local region, preventing premature breakdown.
Solution Approach 2:
The patent optimizes critical parameters including electrode gap distances (D1, D2, D3, D4, D5, D6), overlapping areas, and dielectric layer thicknesses to ensure uniform electric field strength across all series-connected units. By carefully controlling these parameters, the breakdown voltage of each unit is maximized and evenly distributed, achieving high overall breakdown voltage without internal weak points.
3Reliability
If internal electrodes are arranged to form series connection, then higher voltage can be withstood, but uneven electric field distribution and arcing discharge issues occur
Solution Approach 1:
The patent designs the electrode arrangement and dielectric layer configuration to create equipotential regions that ensure uniform electric field distribution across all series-connected capacitor units. By making the overlapping areas and electrode gaps consistent, each unit experiences approximately equal electric field strength, preventing concentration of stress in any single region and eliminating arcing discharge pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The capacitor can withstand higher direct current and radio-frequency voltages without arcing discharge, achieving uniform electric field distribution and preventing burnout.
Implementation Method 1
one end of the fourth internal electrode is corresponding to the adjacent first internal electrode, and forms a first capacitance component, and the other end of the fourth internal electrode is corresponding to the adjacent second internal electrode, and forms a second capacitance component
Data Source
Figure 1
Figure 2~3
AI summary
Embodiments of the present disclosure provide a multi-layer chip ceramic dielectric capacitor, relating to the field of capacitor technologies. For the multi-layer chip ceramic dielectric capacitor provided in the embodiments of the present disclosure, first to fifth internal electrodes are reasonably arranged, and a first capacitance component, a second capacitance component, a third capacitance component and a fourth capacitance component are connected in series to form the capacitor, with the same capacitance, then according to the voltage division principle of capacitor, when each of the small capacitors connected in series bears a voltage of U0, the whole capacitor can withstand a voltage of 4U0. Therefore, the multi-layer chip ceramic dielectric capacitor, in a series structure, provided in the present disclosure can withstand higher direct current and radio-frequency voltages.