Multilayer Ceramic Capacitor Vibration Damping via Insulating Frame
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Solution Overview
Problem
Multilayer ceramic capacitors generate acoustic noise due to piezoelectric vibrations, which can cause listener discomfort and deteriorate audio quality in silent environments and devices with audio circuits.
Innovation Solution
A multilayer ceramic component design that includes a ceramic body with internal and external electrodes, an insulating frame, and conductor electrodes, where the insulating frame and external conductor electrodes absorb mechanical vibrations, reducing the transfer of noise to the board and minimizing acoustic noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a multilayer ceramic capacitor is used to achieve high capacitance and small size, then the capacitance density and miniaturization are improved, but acoustic noise is generated due to piezoelectric vibrations
Solution Approach 1:
An insulating frame structure is introduced as an intermediary element between the ceramic capacitor and the board. This frame absorbs and dissipates the mechanical vibrations generated by the piezoelectric effect, preventing them from being transmitted to the board and causing acoustic noise, while allowing the capacitor to maintain its high capacitance density
Solution Approach 2:
The patent converts the harmful piezoelectric vibrations into a beneficial effect by using the insulating frame to absorb and dissipate the mechanical energy. The frame's elastic deformation absorbs the vibration energy, transforming it into harmless thermal energy through internal friction, thereby eliminating acoustic noise while preserving the capacitor's electrical performance
2Ease of manufacture
If the ceramic body structure is simplified for ease of manufacture, then manufacturing complexity is reduced, but vibration absorption capability is insufficient
Solution Approach 1:
The insulating frame is segmented into multiple portions (first through fourth insulating portions) that can be separately formed and then assembled. This segmentation allows each portion to be optimized for specific functions (e.g., vibration absorption, electrical insulation, mechanical support) while maintaining overall manufacturing simplicity through modular construction
Solution Approach 2:
The patent employs composite material structures where the insulating frame is formed from insulating material that provides both electrical insulation and mechanical vibration absorption properties. The composite structure combines materials with different properties to simultaneously achieve ease of manufacture and effective vibration damping
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively decreases acoustic noise by absorbing vibrations and mechanical stress, improving the audio quality and user experience in electronic devices.
Implementation Method 1
since the dielectric layers have piezoelectric properties, when a direct current (DC) or alternating current (AC) voltage is applied to the multilayer ceramic capacitor, a piezoelectric phenomenon may occur between the internal electrodes to generate periodic vibrations
Implementation Method 2
the insulating frame and external conductor electrodes absorb mechanical vibrations, reducing the transfer of noise to the board and minimizing acoustic noise
Data Source
AI summary
A multilayer ceramic component includes a multilayer ceramic capacitor including a ceramic body including a plurality of first and second internal electrodes, and first and second external electrodes, an insulating frame including a first horizontal insulating portion disposed on one surface of the ceramic body, second and third horizontal insulating portions, and first and second vertical insulating portions, first and second external conductor electrodes including first and second upper horizontal conductor portions, first and second lower horizontal conductor portions, and first and second vertical conductor portions, first and second internal conductor electrodes, and electrical connecting units connecting the first and second upper horizontal conductor portions and the first and second internal conductor electrodes.