Multilayer Ceramic Capacitor Layout for High Withstand Voltage
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge is to design a multilayer ceramic electronic component that achieves high electrostatic capacitance while minimizing the mounting area, as increasing the number of internal electrodes to enhance withstand voltage reduces the effective area and capacitance.
Innovation Solution
The solution involves a multilayer ceramic electronic component with a specific configuration of internal electrodes and external electrodes, where internal electrodes are arranged in series across multiple dielectric layers, and metal terminals are connected to maintain a gap between the component and the mounting substrate, allowing for increased withstand voltage without expanding the mounting area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of divided internal electrodes is increased to increase the number of opposing portions, then the withstand voltage is improved, but the effective area of the opposing portion is reduced and the electrostatic capacitance deteriorates
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration by dividing the laminated body into multiple stacks arranged in the width direction. Each stack contains divided internal electrodes forming capacitors in series, while the overall capacitance is enhanced by the parallel arrangement of multiple stacks. This dimensional transition allows simultaneous achievement of high withstand voltage (through series connection within stacks) and high capacitance (through parallel connection of stacks), resolving the contradiction between voltage resistance and capacitance.
Solution Approach 2:
The laminated body is segmented into multiple independent stacks arranged in the width direction, with each stack containing divided internal electrodes. This segmentation allows the system to achieve high withstand voltage within each stack through series connection of capacitors, while maintaining high overall capacitance through the parallel arrangement of multiple stacks. The segmentation principle enables independent optimization of voltage resistance and capacitance in different spatial regions.
2Quantity of substance
If multiple multilayer ceramic capacitors are mounted on the mounting substrate to counteract the reduced capacitance, then the electrostatic capacitance is improved, but the mounting area becomes large
Solution Approach 1:
The patent merges multiple capacitor units into a single integrated multilayer ceramic component by arranging multiple stacks within one laminated body. Each stack contributes to the overall capacitance through parallel connection, eliminating the need for multiple separate capacitor components. This merging approach achieves the required total capacitance while significantly reducing the mounting area compared to using multiple discrete capacitors, as all capacitor elements are consolidated into one compact component.
Solution Approach 2:
The single multilayer ceramic component performs multiple functions simultaneously: it provides high capacitance through parallel-connected stacks, high withstand voltage through series-connected divided electrodes within stacks, and compact mounting through integrated construction. This multi-functionality eliminates the need for separate components to address different electrical requirements, reducing the overall mounting area while maintaining both capacitance and voltage resistance performance.
3Reliability
If the number of opposing portions of internal electrodes is increased within standard dimensions, then the withstand voltage is improved, but the effective area is reduced making it difficult to acquire electrostatic capacitance
Solution Approach 1:
The patent utilizes the width direction as an additional dimension to arrange multiple stacks side-by-side. Within each stack, divided internal electrodes create multiple opposing portions for series connection (achieving high withstand voltage). The effective area limitation within each stack is compensated by adding more stacks in the width direction, where each stack contributes additional capacitance through parallel connection. This dimensional expansion allows the system to maintain large total effective area while achieving high withstand voltage through vertical series connection within stacks.
Solution Approach 2:
Different regions of the laminated body are assigned different functions: within each stack, divided internal electrodes are arranged to maximize withstand voltage through series connection (local optimization for voltage resistance), while multiple stacks are arranged in the width direction to maximize total capacitance (local optimization for capacitance). This local quality differentiation allows simultaneous optimization of both withstand voltage and effective area utilization across different spatial regions of the component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively increases the withstand voltage while maintaining or reducing the mounting area, ensuring efficient electrostatic capacitance and reducing the risk of mechanical stress and noise transmission.
Implementation Method 1
an first internal electrode 28a connected to the first external electrode 34a, a second internal electrode 28b on the same dielectric layer 26 as the first internal electrode 28a and connected to the second external electrode 34b, and a third internal electrode 28c on a dielectric layer 26 different from the dielectric layer 26 on which the first internal electrode 28a and the second internal electrode 28b are located
Implementation Method 2
a capacitor is formed in a portion in which the internal electrode 4 and the internal electrode 5 are opposed to each other. Thus, a plurality of capacitors are formed between the external electrodes 3 opposed to each other
Data Source
AI summary
A multilayer ceramic electronic component includes an end surface of a second external electrode and an end surface of a fourth external electrode that face a mounting surface of a mounting substrate on which a first multilayer ceramic electronic component body and a second multilayer ceramic electronic component body are mounted. A first metal terminal is connected to the second external electrode, a second metal terminal is connected to the fourth external electrode, and a connection terminal is connected across a first external electrode and a third external electrode. An insulator is disposed between the first multilayer ceramic electronic component body and the second multilayer ceramic electronic component body.