Multilayer Ceramic Capacitor Warpage Strength via Cover Portions
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in achieving high reliability and warpage strength, particularly in applications requiring miniaturization and high integration, where existing structures fail to prevent warpage-related cracks and reliability issues.
Innovation Solution
The design incorporates a ceramic body with dielectric layers and internal electrodes, external electrodes connected to internal electrodes via conductive resin layers that extend onto the ceramic body's surfaces, with specific ratios of cover portion thickness to conductive resin layer extension and distance to length, enhancing warpage strength and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the multilayer ceramic capacitor is miniaturized to achieve high integration, then the size is reduced and integration is improved, but the warpage strength and reliability deteriorate
Solution Approach 1:
The patent applies local quality by creating cover portions with different thicknesses at different locations on the ceramic body. The cover portions have a thickness that varies from the center toward the edges, providing localized reinforcement where warpage stresses are most likely to occur during miniaturization while maintaining overall device compactness.
Solution Approach 2:
The patent uses composite materials by combining the ceramic body with cover portions made of different materials having complementary properties. The cover portions are formed with specific material compositions that provide enhanced mechanical strength and warpage resistance, creating a composite structure that maintains reliability during miniaturization.
2Volume of moving object
If the multilayer ceramic capacitor is miniaturized to achieve high integration, then the size is reduced and integration is improved, but the warpage strength deteriorates
Solution Approach 1:
The patent applies local quality by creating cover portions with different thicknesses at different locations on the ceramic body. The cover portions have a thickness that varies from the center toward the edges, providing localized reinforcement where warpage stresses are most likely to occur during miniaturization while maintaining overall device compactness.
Solution Approach 2:
The patent addresses warpage strength by extending the solution into another dimension - adding cover portions that extend from the top and bottom surfaces toward the side surfaces. This three-dimensional reinforcement structure provides anti-warpage strength without increasing the footprint dimensions, enabling miniaturization while maintaining strength.
3Strength
If the cover portion thickness is increased to improve warpage strength, then the warpage strength is improved, but the device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the cover portions into multiple regions with different thickness characteristics. The cover portions include a first region extending from the top surface and a second region extending from the bottom surface, with thicknesses that are controlled to be equal to or less than half the thickness of the active portion. This segmented approach simplifies manufacturing while providing adequate warpage strength.
Solution Approach 2:
The patent uses parameter changes by precisely controlling the thickness parameter of the cover portions. The thickness is set to specific ranges (equal to or less than half the active portion thickness) to achieve the optimal balance between warpage strength and manufacturing simplicity, avoiding excessive complexity while maintaining performance.
Data Source
AI summary
A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein the external electrodes including, respectively, electrode layers electrically connected to the internal electrodes, respectively, and conductive resin layers disposed on the electrode layers, respectively.