Ceramic Carrier Body with Integrated Cooling Channels
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Solution Overview
Problem
Current power electronics modules face challenges with heat dissipation due to complex layer structures and intermediate materials that act as heat transfer barriers, limiting reliability and performance, and preventing direct integration of electrically conductive heat sinks with heat sources.
Innovation Solution
A carrier body with integrally formed cooling elements, made from ceramic or composite materials, that are electrically insulating but thermally conductive, allowing direct heat transfer and improved thermal management through channels, ribs, or recesses, which can be connected to components via soldering or other methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a complex layer structure with intermediate materials is used to achieve electrical insulation, then electrical insulation is improved, but heat transfer capability deteriorates due to thermal barriers
Solution Approach 1:
The patent merges the electrical insulation function and heat transfer function into a single integrated carrier body made of electrically insulating ceramic material. The cooling elements are directly integrated into the carrier body structure, eliminating the need for separate intermediate insulation layers and their associated thermal barriers.
Solution Approach 2:
The patent extracts the intermediate insulation layers and their thermal barrier function from the system. By using a ceramic carrier body that inherently provides both electrical insulation and thermal conduction, the harmful intermediate layers are removed entirely, allowing direct thermal contact between heat sources and cooling elements.
2Loss of energy
If electrically conductive heat sinks are directly integrated with heat sources, then heat transfer capability is improved, but electrical insulation deteriorates
Solution Approach 1:
The patent changes the material parameter of the carrier body to ceramic, which has fundamentally different electrical and thermal properties compared to conventional PCB materials. Ceramic provides high electrical resistivity while maintaining adequate thermal conductivity, enabling direct integration of conductive cooling elements without compromising electrical insulation.
Solution Approach 2:
The patent uses ceramic material as a composite solution that combines the desirable properties of electrical insulation with sufficient thermal conductivity. This single material replaces both the electrical insulation function and the thermal management function, allowing direct integration of heat sinks without additional insulation layers.
3Reliability
If multiple intermediate layers and connection methods are used, then electrical insulation is maintained, but device complexity increases
Solution Approach 1:
The patent combines multiple functions (electrical insulation, mechanical support, thermal management) into a single carrier body structure. The cooling elements are directly formed as part of the carrier body, eliminating the need for separate insulation layers, adhesives, and mechanical fastening systems.
Solution Approach 2:
The ceramic carrier body serves multiple functions simultaneously: it provides electrical insulation, structural support for mounting heat sources, and integrated thermal conduction pathways through its built-in cooling elements. This multi-functionality eliminates the need for separate specialized components and their associated complexity.
4Ease of manufacture
If conventional PCB materials are used for the carrier body, then ease of manufacture is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent uses ceramic material that provides superior thermal conductivity compared to conventional PCB materials while maintaining electrical insulation. The ceramic can be manufactured using established ceramic processing techniques, making it a practical replacement for organic PCB substrates in high-power applications.
Solution Approach 2:
The patent changes the fundamental material parameter from organic PCB material to ceramic, which has inherently superior thermal conductivity. This material substitution enables effective heat dissipation while maintaining compatibility with standard ceramic manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation, increases power density, and improves long-term reliability by simplifying the structure and reducing thermal barriers, while maintaining electrical insulation and allowing for efficient heat distribution across the carrier body.
Implementation Method 1
the carrier body is integrally formed with heat or feeding cooling elements
Implementation Method 2
the cooling elements are holes, channels, ribs and/or recesses that are acted upon by a cooling medium
Data Source
Figure 1~2
Figure 3~4
Figure 5a~5d
AI summary
The body has heat removing or heat supplying cooling units (7) in a single-piece manner, where the cooling units are channels, rips and recesses that are subjected with heating or cooling medium e.g. gas and fluid such as water or oil. The units are sintered with the body, where the body and/or the units have a ceramic component. The units are connected with the body in a spatial orientation. The set of components emitting light are connected with the body.