Ceramic Element Case Mounting Without Exterior Molding
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Solution Overview
Problem
Conventional electronic devices for surface mounting require a complex assembly process due to the need for a molding step with an exterior material and are inflexible to changes in dielectric disk size.
Innovation Solution
An electronic device design that accommodates a ceramic element in a recess of a case, eliminating the need for a molding step and allowing flexible response to size changes, with metal terminals perpendicular to the ceramic element surfaces for stable mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a molding step with exterior material is used to fix the dielectric disk and metal terminal in a cavity, then the electronic device achieves stable structure and secure mounting, but the assembly process complexity increases and productivity decreases
Solution Approach 1:
The invention extracts and eliminates the exterior molding material from the structure. The metal terminal is designed to extend directly through the dielectric disk without requiring additional molding material to secure it, simplifying the assembly process while maintaining structural integrity through the through-hole configuration.
Solution Approach 2:
The invention segments the structure into distinct functional parts: the dielectric disk with through-holes and the metal terminal as separate components. The metal terminal passes through pre-formed holes in the dielectric disk, allowing independent manufacturing and assembly of each component without requiring complex integrated molding.
2Reliability
If a molding step with exterior material is used to fix the dielectric disk and metal terminal, then the electronic device achieves secure mounting, but the productivity decreases due to additional processing steps
Solution Approach 1:
The invention removes the time-consuming exterior molding step from the manufacturing process. The metal terminal is secured through mechanical insertion into pre-formed through-holes in the dielectric disk, eliminating the need for additional molding cycles and significantly improving production efficiency.
3Adaptability or versatility
If the molding die is changed to accommodate changes in dielectric disk size, then the electronic device can adapt to different specifications, but the flexibility to respond to size changes decreases due to tooling requirements
Solution Approach 1:
The invention creates a universal mounting structure where the metal terminal with through-holes can accommodate various dielectric disk sizes without requiring changes to the fundamental assembly method. The same basic structure and assembly process can be used across different product specifications, improving manufacturing flexibility.
4Area of stationary object
If the metal terminal is positioned perpendicular to the dielectric disk surfaces, then the mounting area is reduced for better surface mounting, but the structural complexity increases
Solution Approach 1:
The invention transitions the metal terminal orientation from a parallel arrangement (increasing mounting area) to a perpendicular arrangement (reducing mounting area). The terminal extends through the thickness dimension of the dielectric disk, allowing compact surface mounting while the through-hole configuration manages the structural complexity.
Data Source
AI summary
An electronic device includes a case, a ceramic element, a first metal terminal, and a second metal terminal. The case includes a recess and its opening edge. The ceramic element is disposed in the recess and includes a first main surface and a second main surface opposing to each other, a first electrode portion formed on the first main surface, and a second electrode portion formed on the second main surface. The first metal terminal includes a first mounting portion disposed on the opening edge and being substantially perpendicular to the first and second main surfaces and a first electrode connection portion connected to the first electrode portion. The second metal terminal includes a second mounting portion disposed on the opening edge and being substantially perpendicular to the first and second main surfaces and a second electrode connection portion connected to the second electrode portion.