Channel structure and semiconductor manufacturing device
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Solution Overview
Problem
Existing semiconductor manufacturing devices are limited in their ability to accurately measure temperature data inside the device, particularly at positions closer to the semiconductor wafer, due to the placement of temperature sensors only on the back surface of the shower plate.
Innovation Solution
A channel structure is introduced that includes a ceramic base with multiple thermocouple portions, each composed of first and second metal wiring, which are connected to form a thermocouple function. These thermocouple portions are strategically located inside the base to provide accurate temperature measurements at various positions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature sensors are placed only on the back surface of the shower plate, then the device structure is simple, but the temperature measurement precision is insufficient
Solution Approach 1:
The thermocouple wires are embedded within the ceramic base structure itself, with the first and second thermocouple wires integrated into the ceramic material. This nesting approach allows temperature sensing functionality to be incorporated inside the base without adding external sensor components, thereby improving measurement precision while maintaining structural simplicity.
Solution Approach 2:
The invention uses a composite structure combining ceramic base material with embedded thermocouple wires (first and second thermocouple wires made of different metals). This composite approach integrates the sensing function directly into the structural component, enabling accurate temperature measurement at multiple positions within the base while avoiding the complexity of separate sensor mounting systems.
2Measurement precision
If multiple temperature sensors are added inside the device, then the temperature measurement precision improves, but the device complexity increases
Solution Approach 1:
The ceramic base serves multiple functions: it provides structural support as the main body of the shower plate and simultaneously acts as the housing for temperature sensing through embedded thermocouple wires. This multi-functionality eliminates the need for separate sensor components and mounting structures, achieving improved temperature measurement precision without increasing device complexity.
Solution Approach 2:
Multiple thermocouple measurement points are nested within the ceramic base at different positions (including positions closer to the semiconductor wafer). By embedding these sensing elements within the existing base structure rather than adding external sensors, the invention achieves comprehensive temperature monitoring while maintaining structural simplicity.
3Measurement precision
If thermocouple portions are embedded inside the ceramic base, then the temperature measurement precision improves, but the manufacturing complexity increases
Solution Approach 1:
The thermocouple wires are embedded into the ceramic base during the base manufacturing process itself, before the final product assembly. This preliminary action allows the sensing elements to be integrated into the ceramic structure in a single manufacturing step, avoiding the need for subsequent complex assembly operations and maintaining manufacturing ease while achieving improved temperature measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of the channel structure with multiple thermocouple portions allows for precise temperature measurement and distribution analysis within the semiconductor manufacturing device, enhancing process control and quality assurance.
Implementation Method 1
The first metal wiring and the second metal wiring are connected to each other inside the base and constitute a thermocouple portion having a thermocouple function
Data Source
AI summary
A channel structure includes a base, a channel, a plurality of openings, first metal wiring, and second metal wiring. The base has a first surface and is constituted of ceramic. The channel is located inside the base and includes a plurality of branch paths. The plurality of openings are located in the first surface and are respectively connected to the plurality of branch paths. The first metal wiring is at least partially located inside the base and is constituted of a first metal. The second metal wiring is at least partially located inside the base and is constituted of a second metal different from the first metal. The first metal wiring and the second metal wiring are connected to each other inside the base and constitute a thermocouple portion having a thermocouple function. The base includes a plurality of the thermocouple portions.