Ceramic Chip Capacitor Packaging With Exposed Metal Terminals
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional super-capacitors face issues with assemblability, productivity, and durability due to moisture absorption in plastic wiring boards, leading to electrolyte leakage and performance degradation, as well as welding and bending defects during terminal attachment.
Innovation Solution
A chip-capacitor design utilizing a ceramic substrate with a nonconductive ceramic layer, a current collecting layer made of ceramic or cermet, and a metal layer exposed outside a ceramic packaging module, which includes a nonconductive ceramic packaging module to accommodate electrolyte, enhancing thermal durability and corrosion resistance through ceramic materials and processes like laser scribing and sintering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a plastic wiring board is used for mounting the cell, then the device can be manufactured with simpler assembly processes, but the device deteriorates in performance due to moisture absorption and electrolyte leakage
Solution Approach 1:
The patent uses a ceramic substrate instead of a plastic wiring board to mount the cell. Ceramic material provides both mechanical support and moisture barrier properties, eliminating the electrolyte leakage problem while maintaining assembly feasibility. The ceramic substrate serves as a composite structure that combines electrical insulation, mechanical strength, and chemical resistance.
Solution Approach 2:
The patent eliminates the need for separate sealing components like gaskets and coating materials by using the ceramic substrate itself as the sealing barrier. This reduces the number of parts and assembly steps while improving reliability, as the ceramic substrate is inherently resistant to moisture and electrolyte penetration.
2Reliability
If conventional sealing methods with gaskets and coating materials are used, then the upper and lower cases can be sealed, but the device requires complex coating and compressing processes that deteriorate productivity
Solution Approach 1:
The patent extracts and eliminates the separate sealing components (gaskets, coating materials) and their associated processes (coating, compressing) from the manufacturing system. The ceramic substrate inherently provides the sealing function, removing the need for additional sealing steps and improving manufacturing efficiency.
Solution Approach 2:
The ceramic substrate serves multiple functions simultaneously: it acts as the mounting board for the cell, provides electrical insulation, and serves as the sealing barrier against moisture and electrolyte. This multi-functionality eliminates the need for separate sealing components and processes.
3Strength
If welding and bending processes are used to attach terminals to the cases, then the terminals can be securely attached, but welding and bending defects frequently occur
Solution Approach 1:
The patent replaces the mechanical welding and bending processes with a laser-based marking process. The laser directly marks the terminal positions on the ceramic substrate without requiring physical contact, welding, or bending operations, thereby eliminating welding defects and bending defects while maintaining secure terminal attachment.
4Ease of manufacture
If a via formed in the wiring board is used for electrolyte injection, then the electrolyte can be injected into the cell, but the via bursts by pressure generated during operation causing electrolyte leakage
Solution Approach 1:
The patent uses a ceramic substrate instead of a plastic wiring board for mounting the cell. The ceramic material provides superior pressure resistance and structural integrity, preventing the via from bursting during operation. The ceramic substrate maintains its structural strength even under the pressure generated during capacitor operation, eliminating electrolyte leakage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances thermal durability and chemical resistance, minimizes electrolyte leakage, and improves the reliability of chip-capacitors by using ceramic materials and processes, reducing the need for complex assembly and minimizing temperature-induced separation between metal layers.
Implementation Method 1
a groove insulating the negative electrode from the positive electrode formed by removing a part of the ceramic substrate with a laser beam
Implementation Method 2
heating and sintering the ceramic substrate and the nonconductive ceramic packaging module
Data Source
AI summary
Disclosed herein is an electrochemical device forming a chip-capacitor or a super-capacitor. The electrochemical device includes: a ceramic substrate having a nonconductive ceramic layer, a current collecting layer disposed on a nonconductive ceramic layer and made of ceramic or cermet, and a metal layer arranged on outer surfaces of the nonconductive ceramic layer and the current collecting layer; an electrode having a positive electrode and a negative electrode and formed on the current collecting layer; and a nonconductive ceramic packaging module located on the ceramic substrate to accommodate electrolyte therein, wherein the metal layer is exposed to the outside of the nonconductive ceramic packaging module.