Ceramic Chip Manufacturing via Dicing and Grinding

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Solution Overview

Problem

The existing methods for manufacturing ceramic chips, such as color conversion members for LED chips, result in rough side surfaces due to friction during cutting, leading to gaps and potential overheating, which compromise the durability and reliability of the LED light-emitting members and deteriorate the optical performance.

Innovation Solution

A method involving forming dicing trenches on a ceramic wafer, followed by rough and fine grinding operations to smooth both the outer and inner surfaces, ensuring the ceramic chips have smooth side surfaces and reduced thickness, thereby eliminating the rough surface issues caused by cutting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a dicing blade is used to cut the ceramic wafer into chips, then the wafer can be divided into individual ceramic chips, but the friction between the dicing blade and the wafer causes the outer peripheral surface to become rough

Engineering Contradiction:

Improvewafer division efficiencyVSAvoidsurface smoothness

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The cutting process is divided into two separate stages: first forming dicing trenches to divide the wafer, then performing surface grinding to smooth the cut surfaces. This segmentation allows each process to be optimized independently - the dicing blade for efficient division and the grinding wheel for surface quality.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The dicing trenches are formed first as a preliminary step, creating the basic chip structure. Then the surface grinding is applied as a subsequent finishing operation to eliminate the roughness caused by the preliminary cutting action.

Inventive Principle:

Principle #10Preliminary action

2Ease of manufacture

If the outer peripheral surface of the ceramic chip is rough, then gaps are formed between the holding member and the ceramic chip, but this causes light scattering and overheating that deteriorates optical performance and reliability

Engineering Contradiction:

Improvechip assembly simplicityVSAvoidLED light-emitting member durability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The mechanical cutting action of the dicing blade is replaced/complemented by a grinding process that uses abrasive removal to smooth the surfaces. This substitution eliminates the harmful mechanical friction effects that cause roughness and subsequent reliability issues.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The rough surfaces created by dicing, which initially appear harmful, are converted into a treatable condition by applying surface grinding. The controlled removal of the rough outer layer transforms the harmful fragmented structure into a smooth, reliable surface that prevents gaps and light scattering.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Reliability

If surface grinding is performed to eliminate roughness, then the side surfaces become smooth and gaps are prevented, but additional manufacturing steps and time are required

Engineering Contradiction:

Improveoptical system durabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The surface grinding operation is merged with the existing dicing process flow, combining the trench formation and surface smoothing into an integrated manufacturing sequence. This reduces the need for separate, standalone grinding equipment and processes.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The grinding process removes the harmful rough surfaces that are self-generated by the dicing operation itself. The system essentially self-corrects the damage caused by the cutting process through a subsequent finishing operation that eliminates the need for external intervention or additional complex equipment.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the reliability and durability of LED light-emitting members by minimizing surface roughness and preventing light scattering, thus maintaining the optical performance and extending the lifespan of the components.

Implementation Method 1

a portion of the wafer is cut while being fragments as the friction between the dicing blade and the ceramic wafer occurs

Methodology Applied

Scientific EffectFriction: Friction

Implementation Method 2

removing a surface in which the dicing trenches are formed by as much as a predetermined thickness to eliminate a rough surface

Methodology Applied

Scientific EffectAbrasion: Abrasion

Data Source

PatentUS11679527B2Manufacturing method of ceramic chips

Publication Date: 2023.06.20 ROOTS CO LTD

AI summary

A method of manufacturing ceramic chips according to one aspect of the present disclosure includes: (A) forming a plurality of dicing trenches on a ceramic wafer; (B) removing a surface in which the dicing trenches are formed by as much as a predetermined thickness to eliminate a rough surface, which is formed on an outer side of each of the dicing trenches when the dicing trenches are formed; and (C) removing a surface opposite to the surface in which the dicing trenches are formed by as much as a predetermined thickness so that the wafer is individualized into a plurality of ceramic chips.