Ceramic Chip Electrode Interface Anchoring Against Peeling

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Solution Overview

Problem

Chip ceramic semiconductor electronic components face issues with reduced fixation strength and potential peeling at the interface between first and second outer electrodes, especially in smaller dimensions, leading to variations in resistance values and reliability concerns.

Innovation Solution

Incorporating hard particles made of a material harder than the first outer electrode at the interface between the first and second outer electrodes, providing an anchor effect that enhances the fixation strength and prevents peeling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the chip dimensions are reduced below the 1005M standard size, then the component size is improved (smaller), but the fixation strength between the first outer electrode and the second outer electrode deteriorates, causing interface peeling

Engineering Contradiction:

Improvechip sizeVSAvoidfixation strength between electrodes

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The patent applies local quality by introducing hard particles specifically at the interface region between the first outer electrode and second outer electrode. This localized modification enhances the fixation strength precisely where peeling occurs, without affecting the overall small chip dimensions. The hard particles create an anchor effect that mechanically interlocks the electrode layers at this critical interface zone.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent employs composite materials by combining the first outer electrode material, second outer electrode material, and hard particles into a multi-material interface structure. This composite approach leverages the mechanical properties of each material - the conductive properties of the electrode materials and the hardness/anchor effect of the hard particles - to achieve both small size and strong fixation strength simultaneously.

Inventive Principle:

Principle #40Composite materials

2Area of stationary object

If the area of contact between the first outer electrode and the second outer electrode is reduced in small-size components, then the chip size is improved (smaller), but the fixation strength deteriorates, leading to interface peeling

Engineering Contradiction:

Improvecontact area between electrodesVSAvoidfixation strength between electrodes

Core Design Contradiction:

Area of stationary objectVSStrength

Solution Approach 1:

The patent applies local quality by concentrating hard particles at the electrode interface region where fixation is needed, rather than uniformly distributing them throughout the entire chip. This localized reinforcement compensates for the reduced contact area by enhancing the mechanical interlocking specifically at the critical interface zones between electrodes.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent changes the physical parameter of the interface structure by introducing hard particles with specific hardness greater than the electrode materials. This parameter change transforms the interface from a simple material contact to a mechanically interlocked structure, thereby improving fixation strength despite the reduced contact area in small-size chips.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The anchor effect from the hard particles improves the fixation strength between the outer electrodes, ensuring reliable electrical connection and preventing peeling, particularly in small-size components, thus maintaining resistance value consistency.

Implementation Method 1

A hard particle made of a material harder than the first outer electrode is provided at an interface between the first outer electrode and the second outer electrode. The hard particle at the interface between the first outer electrode and the second outer electrode provides an anchor effect, and a fixation strength between the first outer electrode and the second outer electrode is improved.

Methodology Applied

Scientific EffectAnchor effect:

Data Source

PatentUS12394544B2Chip ceramic semiconductor electronic component

Publication Date: 2025.08.19 MURATA MFG CO LTD

AI summary

A chip ceramic semiconductor electronic component includes a ceramic body including a ceramic semiconductor, and a first surface and a second surface in contact with the first surface, the first outer electrode on the first surface of the ceramic body, and the second outer electrode covering the first outer electrode and extending onto the second surface of the ceramic body, in which an area of a first surface of the first outer electrode is less than about 0.17 mm2, and a hard particle made of a material harder than the first outer electrode is at the interface between the first and second outer electrodes.