Ceramic Chip Surface Modification for Outer Electrode Edge Rounding
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Solution Overview
Problem
Existing methods for manufacturing ceramic electronic components face challenges in preventing rounding of edge areas in outer electrodes, which affects the gap and surface area between electrodes, and require a more effective surface modification process.
Innovation Solution
A method involving the addition of a modifier, such as a silicon or fluorine compound, to the ceramic chip surface through chemical adsorption or immersion in a solution, followed by firing with a conductive paste, to enhance surface modification and reduce electrode rounding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If surface modification is performed on fired ceramic surface using existing methods, then spreading of conductive paste is reduced, but the surface modification effect is insufficient due to low affinity between modifier and ceramic material
Solution Approach 1:
The organic material is added to the ceramic material before firing to create a temporary surface layer that enhances modifier affinity. This preliminary action creates a receptive surface that will effectively bond with the modifier applied later, solving the low affinity problem of fired ceramic surfaces
Solution Approach 2:
An organic material acts as an intermediary substance between the ceramic material and the modifier. This intermediary layer provides the chemical affinity needed for effective modifier adhesion while ultimately being removed during firing, leaving no harmful residue on the final product
2Ease of manufacture
If conductive paste is applied to ceramic main body, then outer electrodes are formed, but edge areas round due to surface tension and viscosity effects
Solution Approach 1:
The modifier is applied to the ceramic surface before conducting paste application. This preliminary modification creates a surface condition that prevents the conductive paste from spreading and rounding at the edges, maintaining sharp electrode boundaries throughout the manufacturing process
Solution Approach 2:
The surface properties of the ceramic material are changed by adding the modifier, which alters the interaction between the ceramic surface and the conductive paste. This parameter change in surface chemistry prevents the paste from spreading due to surface tension, maintaining precise electrode shapes
3Length of moving object
If gap between outer electrodes is ensured, then electrode separation is achieved, but surface area of outer electrodes is reduced
Solution Approach 1:
The modifier creates a controlled repulsive effect that prevents conductive paste spreading. This previously harmful rounding effect is converted into a beneficial feature that maintains both adequate electrode gaps and maximum electrode surface area, as the paste remains confined to the intended application area without unwanted lateral spread
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces or prevents rounding in edge areas of outer electrodes, ensuring a sufficient surface area and gap between electrodes, improving the manufacturing process for ceramic electronic components like multilayer ceramic capacitors.
Implementation Method 1
the modifier is caused to chemically adsorb to the organic material contained in the chip by a radical reaction
Implementation Method 2
in the step of adding the modifier, the chip is immersed in a solution containing the modifier
Data Source
AI summary
A method of manufacturing a ceramic electronic component includes adding a modifier to a surface of chip containing ceramics and an organic material, applying a conductive paste on the surface of the chip to which the modifier has been added, and firing the chip along with the conductive paste applied on the chip.