Ceramic Electrostatic Chuck Groove Electrode Bonding

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional methods for manufacturing ceramic electrostatic chucks face challenges such as thickness variation in the dielectric layer due to ceramic shrinkage, difficulty in achieving high purity ceramics, and voids at the interface between ceramics and high-melting metal electrodes, particularly in methods involving high-temperature sintering and hot-pressing.

Innovation Solution

A method that forms grooves in a high-density ceramic or composite ceramic dielectric layer for electrode pattern formation, fills these grooves with metal, and uses surface-activated bonding layers to join high-density ceramic or composite ceramic insulator layers at low temperature and low load, eliminating the need for additives and ensuring minimal thickness variation and high purity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If high-temperature sintering is employed to form ceramic electrostatic chucks, then the ceramics can be sintered and formed, but variations in the thickness of the dielectric layer occur due to shrinkage of ceramics

Engineering Contradiction:

Improvethickness variation of dielectric layerVSAvoidsintering temperature

Core Design Contradiction:

Manufacturing precisionVSTemperature

Solution Approach 1:

The patent applies preliminary action by forming the dielectric layer to its final desired thickness before the sintering process. The green sheet is prepared with the exact thickness specification, and after sintering, the layer maintains this thickness without the variations caused by shrinkage that occur in conventional methods where thickness is adjusted after sintering.

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If laminated green sheets with high-melting metal paste are used for electrode formation, then electrodes can be formed, but additives are required for body forming and diffusion components for adhesion, making it difficult to obtain high purity ceramics

Engineering Contradiction:

Improvepurity of ceramicsVSAvoidelectrode formation process

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent applies segmentation by separating the dielectric layer formation from the electrode formation process. The dielectric layer is formed first as a high-purity ceramic without any additives, and then the electrode pattern is formed separately by filling grooves in the dielectric layer with metal, eliminating the need for diffusion components and adhesion promoters in the dielectric layer.

Inventive Principle:

Principle #1Segmentation

3Reliability

If hot-pressing is employed to sinter high-melting metal plates and ceramic powder, then electrodes can be formed, but voids easily occur at the interface between ceramics and high-melting metal plates

Engineering Contradiction:

Improveinterface bonding qualityVSAvoidelectrode formation process

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies inversion by reversing the conventional sequence: instead of forming the electrode first and then bonding the ceramic to it (which causes voids), the dielectric layer is formed first with high density and purity, grooves are made in it, and then the electrode metal is filled into these grooves. This inverted sequence eliminates interface voids and ensures reliable bonding.

Inventive Principle:

Principle #13The other way round (Inversion)

4Manufacturing precision

If conventional methods with additives are used to promote sinterability, then sintering can be facilitated, but the ceramics cannot achieve high purity

Engineering Contradiction:

Improvepurity of ceramicsVSAvoidsintering process efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent applies parameter changes by optimizing the sintering parameters and the composition of the green sheet to achieve high-density sintering without additives. The green sheet is formulated with specific ceramic powders and binders that enable sintering at appropriate temperatures to achieve 95% or higher relative density without requiring purity-compromising additives.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the production of ceramic electrostatic chucks with high purity and minimal dielectric layer thickness variation, avoiding the limitations of conventional methods by achieving strong bonding without additives and maintaining high density and purity.

Implementation Method 1

forming an activated bonding layer configured for joining on the dielectric layer

Methodology Applied

Scientific EffectSurface activation:

Data Source

PatentUS10899670B2Manufacturing method of ceramic electrostatic chuck

Publication Date: 2021.01.26 BLUE OCEAN RES & NETWORK LTD

AI summary

The present invention provides a method for manufacturing a ceramic electrostatic chuck which enables high purity and minimum thickness variation of a dielectric layer formed of ceramics or composite ceramics. The method includes: forming grooves for electrode pattern formation in a dielectric layer formed of ceramics or composite ceramics and having a density of 95% or greater; forming an electrode pattern by filling the grooves with a metal; forming an activated bonding layer configured for joining on the dielectric layer; and joining an insulator layer, which is formed of ceramics or composite ceramics and has a density of 95% or greater, with the dielectric layer.