Ceramic Electrostatic Chuck Joint Structure to Prevent Interface Voids
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Solution Overview
Problem
Existing electrostatic chucking devices experience breakdown due to voids at the interface of ceramic plates, leading to charge accumulation and discharge when high voltage is applied.
Innovation Solution
A ceramic joined body with an electrode layer embedded between ceramic plates, featuring an inclined joint surface between the electrode layer and the ceramic plates to prevent void formation and enhance adhesion, and optionally incorporating an insulating layer around the electrode layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a groove is formed in the ceramic sintered compact and the conductive layer is formed in the groove, then the electrode layer can be integrated with the ceramic plate, but fine spaces (voids) remain at the joint interface between the ceramic plates
Solution Approach 1:
The invention forms a recess portion in the ceramic plate before forming the electrode layer, and then fills the recess portion with the electrode layer material. This preliminary preparation of the recess shape ensures that the electrode layer fully conforms to the ceramic plate surface, eliminating voids at the joint interface before final sintering occurs.
Solution Approach 2:
The invention changes the shape parameter of the joint interface from a simple groove to a recess portion with specific geometric characteristics. The recess portion is designed with a bottom surface and side surfaces that facilitate complete filling by the electrode layer material, transforming the interface geometry to eliminate void formation.
2Ease of manufacture
If the electrode layer is formed in a groove without proper shape design, then the manufacturing process is simple, but voids form at the joint interface causing charge accumulation and discharge
Solution Approach 1:
The recess portion is pre-formed in the ceramic plate with optimized geometry before electrode layer deposition. This preliminary shaping action ensures that subsequent electrode material filling completely occupies the recess space, preventing void formation that would lead to harmful discharge effects.
Solution Approach 2:
The invention applies a localized recess structure at the joint interface region rather than uniform processing throughout the ceramic plate. This local geometric modification targets specifically the area where voids form, improving adhesion and eliminating discharge hazards without complicating the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Suppresses discharge and breakdown in the ceramic plates by ensuring effective adhesion and uniform temperature distribution during high voltage application, enhancing the reliability of electrostatic chucking devices.
Implementation Method 1
joining the one ceramic sintered compact to another ceramic sintered compact by hot press
Implementation Method 2
in an outer edge of the electrode layer, a joint surface between the at least one of the pair of ceramic plates and the electrode layer has an inclination with respect to a thickness direction
Data Source
AI summary
A ceramic joined body includes: a pair of ceramic plates; and an electrode layer that is interposed between the pair of ceramic plates, in which the electrode layer is embedded in at least one of the pair of ceramic plates, and in an outer edge of the electrode layer, a joint surface between the at least one of the pair of ceramic plates and the electrode layer has an inclination with respect to a thickness direction of the pair of ceramic plates and the electrode layer.