Ceramic Electrostatic Chuck Assembly for Uniform Substrate Temperature
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Solution Overview
Problem
The substrate fixing device in existing film forming and plasma etching devices experiences temperature variations on the mounting surface due to thermal deformation differences between the electrostatic chuck and the metal base plate, leading to cohesive failure in the adhesive layer and reduced thermal resistance uniformity.
Innovation Solution
The device employs a ceramic base plate and electrostatic chuck with matching thermal expansion coefficients of 0±3 ppm/K, joined by a brazing part, using low thermal expansion ceramic materials to minimize thermal deformation and stress on the adhesive layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal base plate and ceramic electrostatic chuck are bonded by an adhesive layer, then the device can be assembled and operated, but thermal deformation differences cause cohesive failure in the adhesive layer and temperature variation on the mounting surface
Solution Approach 1:
The patent changes the material parameters of the base plate from metal to ceramic with specific thermal expansion coefficient (0±3 ppm/K) to match the electrostatic chuck material, thereby eliminating thermal deformation differences and preventing adhesive layer failure while maintaining temperature uniformity on the mounting surface
Solution Approach 2:
The patent uses composite ceramic structure where both the base plate and electrostatic chuck are made of ceramic materials with matched thermal properties, creating a thermally compatible composite system that prevents cohesive failure and maintains temperature uniformity across the mounting surface
2Reliability
If ceramic materials with matched thermal expansion coefficients are used for both base plate and electrostatic chuck, then temperature uniformity and adhesive layer reliability are improved, but manufacturing complexity increases
Solution Approach 1:
The patent specifies precise material parameters (thermal expansion coefficient of 0±3 ppm/K) for ceramic materials to ensure thermal compatibility between base plate and electrostatic chuck, achieving reliable thermal performance while the standardized parameter specification helps manage manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maintains uniform temperature on the mounting surface, prevents adhesive failure, and extends the device's operational temperature range, while enhancing rigidity and airtightness.
Implementation Method 1
The base plate is made of a ceramic material having a thermal expansion coefficient of 0±3 ppm/K at a room temperature. The electrostatic chuck is made of a ceramic material having a thermal expansion coefficient of 0±3 ppm/K at the room temperature
Data Source
AI summary
A substrate fixing device includes a ceramic base plate, a ceramic electrostatic chuck having a mounting surface on which an object to be sucked is mounted, and a first brazing part joining the base plate and the electrostatic chuck. The base plate is made of a ceramic material having a thermal expansion coefficient of 0±3 ppm/K at a room temperature. The electrostatic chuck is made of a ceramic material having a thermal expansion coefficient of 0±3 ppm/K at the room temperature.