Ceramic Electrostatic Chuck Structure for Thermal Stress Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate supports in plasma processing apparatuses face challenges due to thermal expansion coefficient differences between the base and electrostatic chuck materials, leading to potential damage and inefficient heat transfer.
Innovation Solution
A substrate support design featuring a ceramic base and electrostatic chuck with ceramic coating, along with multiple metal layers and resin layers, which reduces thermal expansion coefficient differences and enhances heat transfer efficiency through a bonded structure and power feed line configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the base is formed of metal and the electrostatic chuck includes a ceramic coating layer, then the electrostatic chuck can provide good electrical insulation and chemical resistance, but the difference in thermal expansion coefficients between the metal base and ceramic coating causes thermal stress and potential damage during temperature changes
Solution Approach 1:
The substrate support employs a composite structure consisting of a metal base and a ceramic coating layer. The metal base provides mechanical strength and thermal conductivity, while the ceramic coating layer provides electrical insulation and chemical resistance. This composite material approach resolves the contradiction by combining materials with complementary properties to achieve both electrical insulation and thermal stress resistance.
2Temperature
If the base is formed of metal, then the base can provide good thermal conductivity for temperature control, but the difference in thermal expansion coefficients between the metal base and ceramic electrostatic chuck causes damage during heating and cooling cycles
Solution Approach 1:
The patent uses a composite structure with a metal base and ceramic coating layer. The metal base ensures good thermal conductivity for effective temperature control, while the ceramic coating layer protects against thermal expansion damage. This composite approach allows the system to simultaneously achieve excellent thermal management and resistance to thermal shock.
3Reliability
If the electrostatic chuck is made of ceramic material, then the electrostatic chuck can provide good electrical insulation, but the thermal expansion coefficient difference between ceramic and metal base leads to inefficient heat transfer and potential cracking
Solution Approach 1:
The substrate support utilizes a composite structure where the metal base provides efficient heat transfer pathways, while the ceramic coating layer maintains electrical insulation. The metal base acts as a thermal conductor to distribute heat evenly, preventing hot spots and reducing thermal stress on the ceramic layer, thus improving both heat transfer efficiency and preventing cracking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses damage from thermal expansion and improves heat transfer efficiency, ensuring reliable and efficient plasma processing operations.
Implementation Method 1
the coating layer and the base are formed of ceramic. Therefore, the difference in thermal expansion coefficient between the electrostatic chuck and the base is relatively small. Therefore, it is possible to suppress damage to the substrate support due to the difference in the thermal expansion coefficient
Implementation Method 2
The plurality of electrodes include a first metal layer and a second metal layer. The first metal layer is disposed between the central region and the base. The second metal layer is disposed between the annular region and the base
Data Source
AI summary
A disclosed substrate support is used in a plasma processing apparatus. The substrate support includes a base, an electrostatic chuck, and a plurality of electrodes. The base is formed of ceramic. The electrostatic chuck is disposed on the base. The electrostatic chuck includes a central region, an annular region, and a coating layer. The central region is configured to support a substrate placed thereon. The annular region extends to surround the central region and is configured to support an edge ring placed thereon. The coating layer is formed of ceramic. The coating layer is configuring a surface of the electrostatic chuck. The plurality of electrodes include a first metal layer and a second metal layer. The first metal layer is disposed between the central region and the base. The second metal layer is disposed between the annular region and the base.