Ceramic Circuit Board Grounding Conductors for Shielding
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Solution Overview
Problem
The existing methods for manufacturing ceramic circuit boards with exposed grounding pattern conductors often result in insufficient exposure of these conductors at the side surfaces, leading to inadequate connection with the electrically conductive film, which compromises the shielding effectiveness against electromagnetic noise.
Innovation Solution
The ceramic circuit board design includes grounding pattern conductors with a reduced ductility at the side surfaces by varying the metal content, ensuring that the end portions are reliably exposed and connected to the electrically conductive film, achieved through specific composition ratios in the electrode pastes used for forming the pattern main and extended portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the grounding pattern conductor is made with high metal content to ensure good electrical connection, then the electrical conductivity is improved, but the ductility increases causing the conductor to be torn during cutting and insufficient exposure at side surfaces
Solution Approach 1:
The grounding pattern conductor is designed with non-uniform metal content distribution: the extended portion near the side surface has lower metal content (30-60% by volume) to reduce ductility and prevent tearing during cutting, while the pattern main portion inside the board has high metal content (80% or more by volume) to ensure good electrical connection. This local quality variation resolves the contradiction between electrical conductivity and manufacturing precision.
Solution Approach 2:
The metal content parameter of the grounding pattern conductor is changed spatially: the extended portion has metal content of 30-60% by volume, while the pattern main portion has metal content of 80% or more by volume. This parameter change allows the conductor to have different properties in different regions, solving the contradiction between needing high conductivity and avoiding deformation during manufacturing.
2Object-affected harmful factors
If the grounding pattern conductor is exposed at side surfaces to improve shielding effectiveness, then the electromagnetic noise shielding is improved, but the conductor may be torn during cutting leading to insufficient connection with electrically conductive film
Solution Approach 1:
The extended portion of the grounding pattern conductor has reduced metal content (30-60% by volume) compared to the pattern main portion, creating local quality difference. This makes the extended portion less ductile and resistant to tearing during cutting, ensuring reliable exposure at side surfaces and good connection with the electrically conductive film while maintaining electromagnetic shielding effectiveness.
Solution Approach 2:
The grounding pattern conductor is formed as a composite structure with metal particles (30-60% by volume in extended portion) and oxide particles of ceramic insulator layer, creating a composite material with optimized properties. The reduced metal content in the extended portion provides both mechanical strength to prevent tearing and electrical conductivity for shielding, while the oxide content bonds with the ceramic insulator layer.
3Manufacturing precision
If the extended portion of grounding pattern conductor is made with low metal content to reduce ductility and prevent tearing, then the manufacturing precision is improved, but the electrical conductivity may be reduced
Solution Approach 1:
The grounding pattern conductor has spatially varying metal content: the extended portion has 30-60% metal content for manufacturing precision, while the pattern main portion has 80% or more metal content for electrical conductivity. This local quality differentiation resolves the contradiction between manufacturing precision and electrical conductivity.
Solution Approach 2:
The conductor is formed as a composite of metal particles and oxide particles, where the extended portion's composite structure (30-60% metal) provides adequate conductivity while the reduced metal content prevents tearing. The oxide particles bond with the ceramic insulator layer, providing both mechanical support and electrical pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures that the grounding pattern conductors are consistently and effectively connected to the electrically conductive film, enhancing the shielding against electromagnetic noise and maintaining a high level of connectivity.
Implementation Method 1
the metal content of the extended portion is lower than the metal content of the pattern main portion, the ductility of the extended portion is reduced, and the other end portion of the extended portion is not torn when a collective board is cut
Implementation Method 2
Each of the grounding pattern conductors contains a metal and an oxide of at least one metal element contained in the ceramic insulator layer
Data Source
AI summary
A ceramic circuit board that includes a ceramic insulator layer, grounding pattern conductors, connection lands disposed on a first surface of the ceramic circuit board, and grounding electrodes disposed on a second surface of the ceramic circuit board and connected to the grounding pattern conductors. Each of the grounding pattern conductors contains a metal and an oxide and includes a pattern main portion disposed inside the ceramic circuit board and an extended portion in which a first end thereof is connected to the pattern main portion and a second end thereof is exposed at a side surface of the ceramic circuit board. The metal content of the extended portion is lower than the metal content of the pattern main portion.