Ceramic Metal Circuit Board Surface Recesses for Resin Adhesion
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Solution Overview
Problem
Ceramic metal circuit boards without a ceramic substrate exhibit insufficient durability and adhesion to molding resin at high operating temperatures, leading to thermal expansion issues and resin peeling.
Innovation Solution
A ceramic metal circuit board is formed by bonding metal circuit plates to a ceramic substrate, with concave portions on the metal circuit plates within a specific area and depth range to enhance adhesion to the molding resin, reducing thermal stress and peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a metal circuit board is used without a ceramic substrate, then productivity is improved and manufacturing is simplified, but durability and adhesion to molding resin become insufficient at high operating temperatures
Solution Approach 1:
The invention uses a composite structure consisting of a metal circuit board bonded to a ceramic substrate. This composite material approach combines the high productivity and ease of manufacturing of metal circuit boards with the high temperature durability and thermal stability of ceramic substrates, resolving the contradiction between manufacturing efficiency and reliability at elevated temperatures.
2Power
If the operating temperature of the semiconductor element is raised to improve performance, then power element performance is improved, but thermal expansion increases and adhesion to molding resin deteriorates
Solution Approach 1:
The ceramic substrate in the composite structure has superior thermal stability and lower thermal expansion compared to metal alone. This allows the semiconductor element to operate at higher temperatures for improved performance while the ceramic substrate maintains dimensional stability and prevents excessive thermal expansion that would compromise adhesion to the molding resin.
3Strength
If fine concave portions are provided on the metal circuit board to improve adhesion to molding resin, then adhesion is improved, but thermal stress concentration increases at high temperatures
Solution Approach 1:
The ceramic substrate provides a stable, low thermal expansion base that reduces overall thermal stress in the structure. This allows the metal circuit board to have fine concave portions for improved resin adhesion without the same degree of thermal stress concentration, as the ceramic substrate absorbs and distributes thermal stresses more effectively than metal alone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved adhesion and durability of the ceramic metal circuit board to the molding resin, even at high operating temperatures, by creating an anchor effect through the concave portions, thereby enhancing the reliability of semiconductor devices.
Implementation Method 1
concave portions on the metal circuit plates within a specific area and depth range to enhance adhesion to the molding resin, reducing thermal stress and peeling
Data Source
Figure 1~3a
Figure 3b~4c
Figure 4d~5
AI summary
According to one embodiment, a ceramic metal circuit board is a ceramic metal circuit board formed by bonding metal circuit plates to at least one surface of a ceramic substrate. At least one of the metal circuit plates has an area of not less than 100 mm2 and includes a concave portion having a depth of not less than 0.02 mm within a range of 1% to 70% of a surface of the at least one of the metal circuit plates. The concave portion is provided not less than 3 mm inside from an end of the metal circuit plate. An area to provide the concave portion may fall within a range of 3% to 70% of one metal circuit plate surface.