Ceramic Circuit Board Simultaneous Resin Application
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Solution Overview
Problem
Conventional ceramic circuit substrates face productivity issues and degradation in partial discharge characteristics due to separate processes for applying insulating resins, leading to positional displacement and lowered insulating properties.
Innovation Solution
A ceramic circuit substrate with insulating resins applied simultaneously to the main surface and outer peripheral parts of metal circuits, using methods like inkjet or pad printing to ensure precise application and improved positional accuracy, preventing solder flow and partial discharges while maintaining high insulation resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate processes are used to apply insulating resins for preventing solder flow and insulating resins for preventing partial discharges, then both functions can be achieved, but productivity is lowered and positional displacement occurs leading to degraded partial discharge characteristics
Solution Approach 1:
The patent combines the application of solder resist and peripheral resist into a single simultaneous printing process. The insulating resin is applied to both the main surface (for solder flow prevention) and outer peripheral parts (for partial discharge prevention) in one operation, eliminating the need for separate processes and preventing positional displacement between layers.
Solution Approach 2:
The insulating resin application is segmented into different functional zones: the main surface area where solder resist is applied to prevent solder flow and chip displacement, and the outer peripheral parts where resist is applied to prevent partial discharges and migration. This segmentation allows each zone to serve its specific function while being applied simultaneously.
2Reliability
If separate processes are used to apply insulating resins, then both solder flow prevention and partial discharge prevention can be achieved, but the number of processes increases leading to lowered productivity
Solution Approach 1:
The patent merges multiple resist application processes into a single printing operation. By using a printing device that can simultaneously apply insulating resin to both the main surface and outer peripheral parts, the number of separate processes is reduced, simplifying the manufacturing workflow while maintaining both solder flow prevention and partial discharge prevention functions.
3Manufacturing precision
If insulating resins are applied in separate processes, then both functional resins can be applied, but positional displacement occurs leading to lowered insulating properties
Solution Approach 1:
The patent combines the application of multiple insulating resins into a single printing process, ensuring that both the solder resist on the main surface and the peripheral resist are applied simultaneously in their correct positions. This eliminates positional displacement that would occur with sequential application, as both resins are deposited in one controlled operation.
Data Source
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AI summary
[Problem] To obtain a ceramic circuit substrate for a power module wherein an insulating resin for preventing solder flow and chip displacement and an insulating resin for preventing partial discharges and lowering of insulation are applied, without lowering productivity or worsening partial discharge properties, or lowering the insulating properties due to positional displacement of the insulating resins. [Solution] A ceramic circuit substrate for a power module is obtained by applying an insulating resin for preventing solder flow and chip displacement and an insulating resin for preventing partial discharges and the lowering of insulation to a main surface of a metal circuit and to the outer periphery of the metal circuit or between metal circuits, respectively.