Ceramic Circuit Board Heat Dissipation via Segmented Substrate

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Solution Overview

Problem

Conventional ceramic circuit boards are too thick, leading to inefficient heat dissipation from electronic components like LEDs, which reduces their service life and efficiency.

Innovation Solution

A ceramic circuit board with a ceramic-copper plate and a heat-dissipating unit featuring a through-hole and a heat-dissipating layer with higher thermal conductivity than the ceramic substrate, along with a ceramic layer between the heat-dissipating layer and the bottom copper layer, to enhance heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a conventional ceramic substrate is used, then the ceramic circuit board can be manufactured with standard processes, but the thickness is too large (>0.2mm) resulting in inefficient heat dissipation

Engineering Contradiction:

ImprovemanufacturabilityVSAvoidheat dissipation efficiency

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The invention segments the ceramic substrate into two separate substrates: a first ceramic substrate and a second ceramic substrate. This segmentation allows each substrate to be thinner individually, improving heat dissipation efficiency while maintaining manufacturability through standard ceramic processing techniques applied to each layer.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention creates a composite structure by bonding two ceramic substrates together with a bonding layer in between. This composite approach combines the advantages of thin substrates (better heat dissipation) with the strength and stability of a thicker overall structure, while the bonding layer provides mechanical connection and additional thermal management.

Inventive Principle:

Principle #40Composite materials

2Temperature

If the ceramic substrate thickness is reduced to improve heat dissipation, then thermal conductivity improves, but the structural strength and stability may be compromised

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidstructural stability

Core Design Contradiction:

TemperatureVSStrength

Solution Approach 1:

By dividing the thick substrate into two thinner substrates, each layer has better thermal conductivity for heat dissipation, while the combined structure maintains overall structural strength through the bonding interface.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The bonded combination of two ceramic substrates creates a composite structure that achieves both thinness (for heat dissipation) and strength (from the combined layers), overcoming the trade-off between thickness reduction and structural integrity.

Inventive Principle:

Principle #40Composite materials

3Temperature

If a single-layer thin ceramic substrate is used to improve heat dissipation, then thermal performance improves, but manufacturing precision and reliability decrease

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidproduction reliability

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The segmentation into two separate ceramic substrates allows each to be manufactured independently with standard processes, ensuring better manufacturing precision and reliability compared to attempting to manufacture a single thin substrate with exacting tolerances.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The composite structure of two bonded ceramic substrates provides manufacturing flexibility, allowing each layer to be produced separately with conventional techniques, then assembled with reliable bonding, thereby improving overall production reliability.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively increases the service life and efficiency of electronic components by efficiently dissipating heat, improving thermal conductivity and reducing thermal stress on the ceramic substrate.

Implementation Method 1

a heat-dissipating layer that is disposed in the through-hole of the ceramic substrate above the bottom copper layer and that has a thermal conductivity larger than that of the ceramic substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9125335B2Ceramic circuit board and method of making the same

Publication Date: 2015.09.01 TONG HSING ELECTRONICS IND LTD

AI summary

A ceramic circuit board for use in packaging an electronic element includes a ceramic-copper plate, and a heat-dissipating unit that is adapted for dissipating heat from the electronic element. The ceramic-copperplate includes a ceramic substrate that has opposite first and second surfaces, and a through-hole formed through the first and second surfaces, a top copper pattern that overlies the first surface of the ceramic substrate and that has at least two conducting portions spaced apart from each other, and a bottom copper layer that underlies the second surface of the ceramic substrate. The heat-dissipating unit includes a heat-dissipating layer that is disposed in the through-hole of the ceramic substrate above the bottom copper layer and that has a thermal conductivity larger than that of the ceramic substrate. A method of making the ceramic circuit board is also disclosed.