Ceramic Circuit Board with Sputtered Thin Layers for Precision
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Solution Overview
Problem
Conventional ceramic circuit boards face challenges with metal circuit accuracy due to lateral etching in chemical etching processes, leading to potential electrical shorts and the need for varying metal circuit thicknesses.
Innovation Solution
A manufacturing method for a circuit board structure that includes a metallized ceramic substrate with a first and second metal layer, a patterning step to form thick circuit layers, a sputtering step to create a sputtering conductor layer, a shielding step, an electroplating step, and a chemical etching step to form thin circuit layers with precise thickness and pattern accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If chemical etching process is used to form metal circuits, then manufacturing simplicity is improved, but pattern accuracy deteriorates due to lateral etching
Solution Approach 1:
The manufacturing process is segmented into multiple distinct steps: chemical etching to form thick circuit layers, followed by a separate sputtering step to form thin circuit layers. This segmentation allows each step to be optimized independently - the chemical etching can be simple and aggressive for thick layers, while the sputtering step provides precise control for thin layers without lateral etching issues.
Solution Approach 2:
The invention changes the material deposition parameter from chemical etching alone to a combination of chemical etching and sputtering. The sputtering process uses physical vapor deposition parameters to create thin circuit layers with precise thickness control (1-150 μm) and no lateral etching, thereby improving pattern accuracy while maintaining manufacturing feasibility.
2Ease of manufacture
If single thickness metal circuits are used, then manufacturing simplicity is improved, but adaptability deteriorates for meeting various practical requirements
Solution Approach 1:
The circuit layers are segmented by thickness into two distinct types: thick circuit layers (≥200 μm) formed by chemical etching and thin circuit layers (1-150 μm) formed by sputtering. This segmentation enables the board to accommodate different thickness requirements for different circuit regions, improving adaptability while maintaining manufacturing simplicity through dedicated processes for each thickness range.
Solution Approach 2:
The invention changes the thickness parameter by employing two different formation methods with different thickness capabilities. Chemical etching provides thick layers (≥200 μm) suitable for high current carrying capacity, while sputtering provides thin layers (1-150 μm) for precise patterning and signal integrity, thereby achieving multi-thickness adaptability.
3Ease of manufacture
If lateral etching occurs in chemical etching process, then manufacturing simplicity is maintained, but reliability deteriorates due to electrical short issues
Solution Approach 1:
The process segments circuit formation into two stages: chemical etching for thick layers and sputtering for thin layers. The sputtering step specifically addresses reliability issues by forming thin circuit layers without lateral etching, thereby preventing electrical shorts while maintaining manufacturing simplicity through the established chemical etching process for thick layers.
Solution Approach 2:
The sputtering process acts as an intermediary step between the chemical etching and the final thin circuit layer formation. This intermediary step eliminates the lateral etching problem by using physical vapor deposition instead of chemical etching for thin layers, thereby preventing electrical shorts while maintaining overall manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively minimizes lateral etching, ensuring high pattern accuracy of thin circuit layers and preventing electrical shorts, while allowing for the accurate formation of both thick and thin circuit layers to meet various practical requirements.
Implementation Method 1
The sputtering step is implemented by sputtering the first processing region of the ceramic board to form a first sputtering conductor layer
Implementation Method 2
The electroplating step is implemented by electroplating the first sputtering layout segment of the first sputtering conductor layer to form a first electroplating layer
Data Source
AI summary
A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a ceramic board, a thick circuit layer formed on the ceramic board, and a thin circuit layer that is formed on the ceramic board. The thick circuit layer has a thickness being greater than or equal to 200 μm, and the thin circuit layer has a thickness being within a range from 1 μm to 150 μm. The thin circuit layer includes a sputtering layout segment connected to the ceramic board and an electroplating layer that is connected to the sputtering layout segment. The material of the electroplating layer is different from that of the sputtering layout segment.