Ceramic Coated Article for Plasma Etch Chamber
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Solution Overview
Problem
In the semiconductor industry, plasma etch and clean processes can corrode processing chambers and contaminate substrates, leading to device defects due to high-speed plasma exposure, which is exacerbated by shrinking device geometries and stringent particle contamination requirements.
Innovation Solution
A ceramic article with a ceramic body roughened to 140-240 micro-inches is coated with a Y4Al2O9 and Y2-xZrxO3 solid solution ceramic coating, optimized for adhesion strength and polished to reduce delamination and surface roughness, providing enhanced plasma resistance and mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If plasma etch and clean processes are used to process substrates, then device fabrication is enabled, but particle contamination increases and substrate quality deteriorates
Solution Approach 1:
A ceramic coating layer is applied as an intermediary between the plasma environment and the substrate. This coating acts as a protective barrier that prevents direct interaction between corrosive plasma and chamber surfaces, thereby reducing particle generation while maintaining plasma process effectiveness for device fabrication
Solution Approach 2:
The patent employs composite ceramic materials with specific compositions (including Al2O3, Y2O3, and other oxides in controlled ratios) to create a coating that simultaneously provides plasma resistance and minimizes particle contamination. The composite structure allows optimization of both protective properties and cleanliness
2Adaptability or versatility
If device geometries are shrunk to increase integration, then device functionality is improved, but susceptibility to particle contamination increases
Solution Approach 1:
The ceramic coating is applied in advance to chamber surfaces before substrate processing. This preliminary protective layer prevents the generation of particles during plasma processes, thereby protecting sensitive miniaturized device geometries from contamination before exposure occurs
Solution Approach 2:
The coating serves as an intermediary barrier that isolates the plasma environment from chamber components, preventing particle generation that would otherwise contaminate shrunk device geometries and compromise device functionality
3Reliability
If ceramic materials are selected for plasma resistance, then chamber corrosion is reduced, but manufacturing complexity and material selection difficulty increase
Solution Approach 1:
The patent specifies composite ceramic coatings with defined compositions (Al2O3, Y2O3, and other oxides in specific ratios) that provide reliable plasma resistance. By establishing a standardized composite formulation, the complexity of material selection is reduced while maintaining high plasma resistance performance
Solution Approach 2:
The patent defines specific compositional parameters and ratios for the ceramic coating materials (including weight percentages of various oxides) to optimize plasma resistance. By controlling these parameters within specified ranges, reliable plasma resistance is achieved while simplifying the material selection and fabrication process
Data Source
AI summary
To manufacture a ceramic article, a ceramic body comprising Al2O3 is roughened to a roughness of approximately 140 micro-inches (μin) to 240 μin. The ceramic body is subsequently cleaned and then coated with a ceramic coating. The ceramic coating comprises a compound of Y4Al2O9 (YAM) and a solid solution of Y2-xZrxO3. The ceramic coating is then polished.