Ceramic-Coated Rollers for Semiconductor Resin Molding
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Solution Overview
Problem
The existing semiconductor packaging process using metallic rollers to mold resin compositions results in pulverized metals being mixed into the resin, leading to unreliable insulation and potential short circuits due to metallic foreign substances.
Innovation Solution
A molding device with rollers having ceramic outer surfaces, specifically oxide ceramic materials, to prevent metallic fragments from being incorporated into the resin composition during the molding process, ensuring reliable insulation and preventing short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If metallic rollers are used to mold resin composition, then the molding process can be performed with conventional materials, but pulverized metals are produced by friction and mixed into the resin composition as metallic foreign substances
Solution Approach 1:
The roller is constructed as a composite structure with a metallic core portion providing mechanical strength and a ceramic outer layer providing contamination-free molding surface. This composite structure resolves the contradiction by combining the advantages of metallic materials (ease of manufacture) with ceramic materials (no pulverized metal contamination).
Solution Approach 2:
The ceramic outer layer acts as an intermediary between the metallic core and the resin composition. It transfers the molding function from the metal to a non-metallic material, preventing direct contact between metal and resin, thus eliminating metallic contamination while maintaining the structural benefits of metal rollers.
2Object-affected harmful factors
If ceramic material is used for roller outer surface, then pulverized metals are prevented from mixing into resin composition, but the roller structure becomes more complex with core portion and outer layer
Solution Approach 1:
The roller employs a composite structure where a metallic core portion is combined with a ceramic outer layer. This structure is not overly complex because it uses a straightforward layered configuration where each material performs its optimal function: the metal core provides structural integrity while the ceramic surface prevents contamination.
Solution Approach 2:
Different parts of the roller have different material properties optimized for their specific functions. The core portion uses metallic material for mechanical strength and structural support, while the outer peripheral surface uses ceramic material for contamination-free contact with the resin. This local differentiation of material quality resolves the complexity issue by making each part serve its specific purpose efficiently.
3Reliability
If ceramic outer layer is applied to rollers, then reliable insulation is ensured for semiconductor chip sealing, but manufacturing process becomes more involved
Solution Approach 1:
The ceramic-coated roller structure ensures reliable insulation for semiconductor chip sealing by preventing metallic contamination. The ceramic outer layer provides electrical insulation and prevents metal particles from entering the resin, thereby ensuring insulation reliability. The manufacturing complexity is managed through established ceramic coating techniques.
Solution Approach 2:
The ceramic outer layer serves as an intermediary barrier between the metallic core and the resin composition, ensuring electrical insulation and preventing contamination. This intermediary layer guarantees reliable insulation for semiconductor packaging while the underlying metal core maintains structural integrity.
Data Source
AI summary
A molding device for molding a resin composition into a sheet shape by pressurizing the resin composition has a pair of rollers arranged parallel to one another. Each of the rollers has a columnar or cylindrical core portion and an outer layer provided on an outer periphery of the core portion. The outer layer is constituted of the ceramic material. A thickness of the outer layer is in the range of 0.2 to 100 nm. Further, an arithmetic mean deviation of a profile Ra of an outer peripheral surface of each of the rollers defined by JIS B 0601 is in the range of 0 to 2 μm.