Multilayer Ceramic Component Coating for Moisture and Ion Migration
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Solution Overview
Problem
Multilayer ceramic electronic components face issues such as moisture penetration, ion migration, and mechanical stress due to temperature fluctuations and vibrations, leading to reliability concerns like short circuits.
Innovation Solution
A multilayer ceramic electronic component is designed with a protective layer comprising an adhesion assisting layer and a coating layer, with specific thickness ratios and ranges to enhance moisture resistance, suppress ion migration, and improve bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a plating layer is formed on the external electrode after sintering, then the external electrode can be manufactured, but a hydrophilic oxide layer forms on the ceramic body surface creating pores that allow moisture penetration
Solution Approach 1:
The patent introduces a protective layer as an intermediary substance between the external electrode and the environment. This protective layer fills the pores created during manufacturing and prevents moisture from penetrating into the ceramic body, thereby resolving the contradiction between ease of manufacture and prevention of moisture penetration.
Solution Approach 2:
The patent applies a thin film protective layer on the surface of the ceramic electronic component. This thin film acts as a barrier that prevents moisture penetration while being thin enough not to interfere with the manufacturing process or the functionality of the component.
2Ease of manufacture
If the oxide layer with high surface energy remains on the ceramic body surface, then the surface can be formed naturally, but moisture adheres easily to the surface under high temperature and humidity conditions
Solution Approach 1:
The patent changes the surface properties of the ceramic body by applying a protective layer with different surface energy characteristics. This protective layer reduces the surface energy and hydrophilicity of the original oxide layer, preventing moisture adhesion under high temperature and humidity conditions while maintaining the ease of surface formation.
3Ease of manufacture
If the protective layer is too thin, then the manufacturing process is simple, but ion migration can occur through the protective layer
Solution Approach 1:
The patent optimizes the thickness parameter of the protective layer to a specific range that prevents ion migration while maintaining manufacturing simplicity. By carefully controlling the thickness within an optimal range, the patent achieves both ease of manufacture and reliable ion migration prevention.
4Object-affected harmful factors
If the protective layer is too thick, then moisture resistance is improved, but the bonding strength between the protective layer and ceramic body decreases
Solution Approach 1:
The patent optimizes the thickness parameter of the protective layer to achieve a balance between moisture resistance and bonding strength. By controlling the thickness within an optimal range, the patent ensures sufficient moisture resistance while maintaining strong bonding between the protective layer and the ceramic body.
Solution Approach 2:
The patent uses a composite structure consisting of the ceramic body and the protective layer. This composite material approach allows the protective layer to provide moisture resistance while the interface between the ceramic body and protective layer maintains strong bonding through proper material selection and interface design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively prevents moisture penetration, suppresses ion migration, reduces defects such as short circuits, and enhances the overall reliability of the multilayer ceramic electronic component.
Implementation Method 1
a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer
Implementation Method 2
ion migration will occur in the external electrode of the multilayer ceramic electronic component itself increases. The oxide layer formed on the surface of the ceramic body has high surface energy, and allows moisture to easily adhere to the surface
Implementation Method 3
the protective layer includes an adhesion assisting layer and a coating layer
Implementation Method 4
a hydrophilic oxide layer having high surface energy is formed on a surface of the ceramic body, and a possibility that pores that become paths through which moisture may penetrate will be generated
Data Source
AI summary
A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer, an average thickness of the protective layer is 70 nm or more and/or less than 400 nm, and a ratio of an average thickness of the coating layer to the average thickness of the protective layer is 0.25 or more and/or 0.75 or less.