Monolithic Ceramic Component Coil Conductor Segmentation
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Solution Overview
Problem
Monolithic ceramic electronic components face issues such as cracking and coil conductor breakage due to differences in thickness and contraction behavior between ceramic layers with and without coil conductors, as well as displacement and deformation during the stacking and press-bonding process.
Innovation Solution
The solution involves a monolithic ceramic electronic component with coil conductors that have multiple turns per ceramic layer, comprising surface coil conductors on the layer surfaces and intra-layer coil conductors inside the layers, with connecting portions for series connection, and a method of producing these components by forming coil conductors on ceramic green sheets and stacking them to ensure electrical insulation and reduced stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If coil conductors are formed on ceramic green sheets by printing using conductive paste, then the coil conductors can be easily formed, but differences in thickness and density occur between portions with and without coil conductors, causing cracking during firing
Solution Approach 1:
The invention divides the coil conductor into two parts: a first coil conductor formed by printing on the ceramic green sheet, and a second coil conductor formed by filling a groove with conductive paste. This segmentation allows each part to serve a specific function - the printed conductor provides ease of formation while the groove-filled conductor provides uniformity and structural support, thereby resolving the contradiction between ease of manufacture and manufacturing precision.
Solution Approach 2:
The invention forms the first coil conductor by printing on the ceramic green sheet before forming the groove and filling it with conductive paste. This preliminary action of printing the conductor pattern establishes the basic coil structure early in the manufacturing process, allowing subsequent groove formation and filling to enhance uniformity without compromising the ease of initial conductor formation.
2Adaptability or versatility
If multiple ceramic green sheets are stacked and press-bonded to form the component body, then the coil component can be constructed with multiple layers, but displacement, deformation, and breaking of coil conductors occur during stacking and press-bonding
Solution Approach 1:
The invention segments the coil conductor formation process into two distinct stages: forming the first coil conductor on the green sheet, then forming the groove and filling it with a second conductor. This segmentation creates a more robust conductor structure that can withstand the mechanical stresses of stacking and press-bonding, while still enabling multi-layer construction through the use of multiple ceramic green sheets.
Solution Approach 2:
The groove filled with conductive paste acts as a cushioning structure that protects the coil conductor during stacking and press-bonding operations. The groove provides mechanical support and prevents displacement, while the conductive paste filling ensures electrical continuity, thereby cushioning against the harmful effects of mechanical stress before the final sintering process.
3Strength
If the component body is fired to complete the ceramic component, then the component achieves its final strength and properties, but cracking occurs due to differential contraction between portions with and without coil conductors
Solution Approach 1:
The invention achieves homogeneity in contraction behavior during firing by ensuring that all portions of the ceramic green sheet, whether with printed conductors or with groove-filled conductors, have similar thickness and density characteristics. The groove-filled conductor portion is specifically designed to match the thickness and material properties of the base ceramic, ensuring uniform thermal contraction during the firing process and preventing cracking.
Data Source
AI summary
A monolithic ceramic electronic component including coil conductors is capable of reducing the number of stacked ceramic layers without sacrifice of the performance of coils and be capable of increasing the number of turns of the coils without increasing the size in. In the monolithic ceramic electronic component, coil conductors having more than one turn for one ceramic layer are formed. The coil conductors include surface coil conductors that are located along surfaces of sequentially stacked ceramic layers and intra-layer coil conductors that are located inside the ceramic layers so as not to extend beyond the thickness of the individual ceramic layers. The surface coil conductors and the intra-layer coil conductors are connected in series with connecting portions therebetween.