Multilayer Ceramic Component Asymmetric Step Design
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Solution Overview
Problem
Multilayer ceramic electronic components often suffer damage during mounting due to stress concentration at the interface between outer electrodes and the component body, particularly when a protruding portion is present on the main surface, acting as a fulcrum and increasing the likelihood of damage.
Innovation Solution
The design includes a ceramic element body with first and second inner electrodes alternately disposed in the thickness direction, where the first outer electrode extends from the first end surface to both main surfaces with a Cu plating film, and the second outer electrode extends from the second end surface to both main surfaces with a Cu plating film, with the size of the step portion on the second main surface being smaller than on the first main surface, and the Cu plating film length on the second main surface being longer, reducing the distance between outer electrodes and minimizing stress concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a protruding portion is formed on the main surface due to thickness difference from inner electrode arrangement, then the inner electrodes can be disposed alternately in the thickness direction, but the protruding portion acts as a fulcrum during mounting causing stress concentration and increasing damage probability
Solution Approach 1:
The patent applies local quality by creating asymmetric step portions at different locations on the main surface. The first step portion has a different size than the second step portion, allowing differential stress distribution during mounting. This localized variation in surface geometry prevents the uniform stress concentration that occurs with symmetric protruding portions, thereby reducing damage probability while maintaining the alternating inner electrode structure.
Solution Approach 2:
The patent employs asymmetry by making the first and second step portions unequal in size. The first step portion extends from a first position to a second position, while the second step portion extends from a third position to a fourth position, with the distance between the first and second positions being different from the distance between the third and fourth positions. This asymmetric configuration prevents the component from having a symmetric fulcrum point during mounting, reducing stress concentration and improving reliability.
2Strength
If the Cu plating film length on the second main surface is made longer, then the distance between outer electrodes is reduced minimizing stress concentration, but the step portion size on the second main surface must be made smaller
Solution Approach 1:
The patent applies parameter changes by varying the dimensions of step portions and Cu plating film lengths across different surfaces. The first step portion has a first size with an associated first Cu plating film length, while the second step portion has a second size with a second Cu plating film length. By adjusting these parameters asymmetrically, the patent optimizes stress distribution during mounting while maintaining proper electrode spacing and electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces or prevents damage to the multilayer ceramic electronic component during mounting by minimizing stress concentration and ensuring proper orientation, thereby enhancing the component's reliability and durability.
Implementation Method 1
The first outer electrode includes a plating film containing Cu. The length of a portion of the plating film containing Cu that is positioned on the first main surface in the length direction and the length of a portion of the plating film containing Cu that is positioned on the second main surface in the length direction are different from each other.
Data Source
AI summary
In a multilayer ceramic electronic component, a size of a step portion on a first main surface and a size of a step portion on a second main surface are different from each other. A first outer electrode includes a plating film containing Cu. A length of a portion of the plating film containing Cu that is positioned on the first main surface in a length direction and a length of a portion of the plating film containing Cu that is positioned on the second main surface in the length direction are different from each other.


