Ceramic Electronic Component Break Groove Design
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Solution Overview
Problem
The existing methods for manufacturing ceramic electronic components with external terminal electrodes, such as the break method, often result in 'break defects' due to uneven stress distribution, leading to cracks or chips during the division process, especially when forming narrow gaps between electrodes.
Innovation Solution
The solution involves forming recessed grooves on the side surfaces of the ceramic element assembly that extend to the principal surface, creating regions with and without external conductor edges, allowing for a smoother break along a predetermined line by concentrating break leading holes around the extending recessed grooves, reducing the pitch between them, and ensuring the grooves partially overlap or are independent.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the break method is used to divide the collective component, then production efficiency is improved and plating/measurement processes can be performed on collective components, but break defects such as cracks or chips occur due to uneven stress distribution
Solution Approach 1:
The patent applies local quality by creating a break groove with varying depth along its length. The groove depth is locally adjusted to be greater at specific positions (where external conductor edges are located) and smaller at other positions, thereby creating non-uniform stress distribution that guides the break to occur precisely at desired locations while preventing defects in critical areas.
Solution Approach 2:
The break groove is formed in advance during the manufacturing process, before the actual breaking operation. This preliminary action prepares the stress distribution pattern in the collective component, ensuring that when breaking occurs, it follows the predetermined path without causing defects to the external conductors or ceramic element assemblies.
2Reliability
If discontinuous linear break grooves are formed to prevent cracks, then reliability is improved, but break defects still occur at narrow gap portions between external terminal electrodes
Solution Approach 1:
The patent addresses narrow gap portions by locally increasing the groove depth at positions corresponding to external conductor edges. This local modification ensures that even at narrow gaps between external terminal electrodes, the stress concentration is sufficient to guide the break properly, preventing break defects while maintaining the crack prevention benefits of discontinuous grooves.
3Adaptability or versatility
If external terminal electrodes are formed on one surface or two opposite surfaces, then manufacturing flexibility is improved and non-immersion methods can be used, but precise laser beam irradiation is required when burying components, increasing process difficulty
Solution Approach 1:
The break groove configuration with controlled depth variations is established in advance during manufacturing. This preliminary structuring of stress distribution patterns enables subsequent breaking and burying operations to proceed with standard precision requirements, as the break paths are pre-determined by the groove geometry rather than requiring real-time precise laser irradiation.
Data Source
AI summary
A collective component has a first region that intersects with a conductive film for external terminal electrodes in a break line in which break leading holes are arranged and a second region that does not intersect with the conductive film for external terminal electrodes in the break line. The plurality of break leading holes includes at least one extending break leading hole located so as to extend over the first region and the second region.