Ceramic Electronic Component Break Line Design
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Solution Overview
Problem
Existing methods for manufacturing ceramic electronic components with external terminal electrodes face issues such as crack formation, chip occurrence, and break defects when using cutting tools or break methods with discontinuous grooves, especially when trying to minimize gaps between electrodes and increase electrode area for burial in multilayer wiring boards.
Innovation Solution
The solution involves forming recessed grooves on the side surfaces of ceramic element assemblies, with specific pitch and length relationships between first and second regions, to guide a smooth break along a predetermined line, reducing the occurrence of break defects and allowing for increased external conductor area without requiring high accuracy in laser beam irradiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discontinuous linear break grooves are formed to prevent cracks during handling, then reliability is improved, but manufacturing precision deteriorates due to break defects occurring at gap portions between grooves
Solution Approach 1:
Break leading holes are formed in advance in the collective component before the break process. These holes are positioned to overlap with the gap portions between external terminal electrodes, creating predetermined break initiation points that guide the break path and prevent uncontrolled cracking during subsequent handling.
Solution Approach 2:
The break leading holes act as intermediary structures that mediate between the external terminal electrodes and the break line. By positioning these holes at specific locations (overlapping with electrode gaps), they serve as controlled stress concentration points that redirect the break path away from critical areas and prevent break defects.
2Productivity
If external terminal electrodes are formed with narrow gaps to increase electrode area for burial, then productivity is improved, but manufacturing precision deteriorates due to break defects at gap portions
Solution Approach 1:
Break leading holes are pre-formed at locations that overlap with the gap portions between external terminal electrodes. This preliminary action creates controlled break initiation points that guide the break path through non-critical areas, enabling the use of narrow gaps between electrodes to maximize electrode area for burial applications without causing break defects.
Solution Approach 2:
The break leading holes are selectively positioned only at specific locations where they overlap with external terminal electrode gaps. This local application of the break leading hole structure allows narrow gaps between electrodes to be maintained for productivity while preventing break defects only at the critical gap portions.
Data Source
AI summary
A collective component has a first region that intersects a conductive paste film for external terminal electrodes in a break line in which break leading holes are arranged and a second region that does not intersect a conductive paste film for external terminal electrodes in the break line. The first break leading holes are formed in the first region so as not to reach the second region. The second break leading holes are formed only in the second region or from the second region to a portion of the first region. The pitch of the first break leading holes is wider than the pitch of the second break leading holes.