Ceramic Electronic Component Carrier Substrate Mounting
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Solution Overview
Problem
The downsizing of electronic devices requires thinner ceramic electronic components, which compromises their mechanical strength and makes them susceptible to cracks during mounting, leading to potential insulation resistance issues due to moisture intrusion.
Innovation Solution
A ceramic electronic component with a carrier substrate, featuring a first adhesive layer on the principal surface and a second adhesive layer between the ceramic component and the carrier substrate, which reduces the risk of cracking by allowing the carrier substrate to absorb the impact during mounting and is easily removable after attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the ceramic body is decreased to downsize the electronic component, then the electronic device can be downsized and functionality enhanced, but the mechanical strength against external force is reduced making the component susceptible to cracks during mounting
Solution Approach 1:
The patent applies beforehand cushioning by providing a carrier substrate that the ceramic electronic component is temporarily mounted on before actual installation. This carrier substrate acts as a cushioning support during the mounting process, absorbing external forces and preventing cracks in the thinned ceramic body. The carrier substrate is specifically designed to provide mechanical support during handling and mounting operations.
2Strength
If the thickness of the ceramic body is increased to maintain mechanical strength, then the component becomes more resistant to cracks during mounting, but the electronic device cannot be downsized and internal space is wasted
Solution Approach 1:
The patent applies segmentation by dividing the mechanical support function into two separate components: the thinned ceramic electronic component body and the separate carrier substrate. This allows the ceramic component to maintain its reduced thickness for downsizing while the carrier substrate provides the necessary mechanical strength and protection during mounting operations.
3Strength
If a carrier substrate is attached to the ceramic electronic component to prevent cracks during mounting, then mechanical strength is enhanced, but the device complexity increases due to additional components and attachment layers
Solution Approach 1:
The patent applies discarding and recovering by designing the carrier substrate as a temporary support structure that is discarded after serving its protective function during mounting. The carrier substrate is intentionally made removable through controlled adhesive bonding, allowing it to be discarded after the ceramic component is securely mounted on the target board, thus eliminating its complexity from the final product.
4Volume of moving object
If the ceramic electronic component is made thinner for downsizing, then the electronic device internal space is optimized, but insulation resistance deteriorates due to potential cracks from moisture intrusion
Solution Approach 1:
The patent applies beforehand cushioning to prevent cracks that would lead to moisture intrusion and insulation resistance deterioration. The carrier substrate provides protective support before the mounting process completes, preventing impact-induced cracks that would compromise the ceramic body's integrity and allow moisture penetration, thereby maintaining insulation resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the mechanical strength of thin ceramic components during mounting and prevents cracks, maintaining insulation resistance while allowing for efficient temporary attachment and easy removal of the carrier substrate.
Implementation Method 1
a first adhesive layer is provided on the first principal surface of the ceramic electronic component
Implementation Method 2
a second adhesive layer is provided between the second principal surface of the ceramic electronic component and the carrier substrate
Data Source
AI summary
A ceramic electronic component with a carrier substrate includes a ceramic electronic component including first and second principal surfaces, first and second end surfaces, first and second side surfaces, and at least two external electrodes on an outer surface of the ceramic electronic component, and a carrier substrate attached to the second principal surface of the ceramic electronic component, wherein a first adhesive layer is on the first principal surface of the ceramic electronic component.