Laminated Ceramic Component Cover Layer Grain Control
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Solution Overview
Problem
The miniaturization of electronic products has led to a demand for high-capacity laminated ceramic electronic components with improved humidity resistance, as thinner dielectric layers and increased laminations compromise the reliability and lifespan of these components.
Innovation Solution
A laminated ceramic electronic component design featuring a ceramic body with a dielectric layer and internal electrodes, where the cover layer's thickness is less than 5% of the ceramic body's thickness, and the average particle diameter of dielectric grains in the cover layer is controlled to maintain optimal humidity resistance, with specific ratios between different parts of the cover layer ensuring effective capacitance and non-capacitance forming parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the cover layer thickness is reduced to enable miniaturization and high capacity, then the component size is reduced and capacity is increased, but the humidity resistance characteristics deteriorate and reliability is reduced
Solution Approach 1:
The patent applies local quality by creating a gradient in dielectric grain particle diameters within the cover layer. The outermost part has larger particles (Dc1) while the intermediate part has smaller particles (Dc2), with Dc1/Dc2 satisfying 1.11≦Dc1/Dc2≦2.91. This localized variation in particle size provides enhanced humidity resistance at the outer surface while maintaining the thin overall structure for miniaturization.
Solution Approach 2:
The patent changes the physical parameter of particle diameter distribution within the cover layer to resolve the contradiction. By controlling the ratio of particle diameters in different regions (Dc1/Dc2 and Dc1/Dc3) and maintaining T≦t×0.05, the structure achieves both miniaturization and improved humidity resistance through parameter optimization rather than simply increasing thickness.
2Quantity of substance
If the dielectric layer thickness is reduced to increase the number of laminations, then the capacity is increased, but the manufacturing precision and structural integrity become more difficult to control
Solution Approach 1:
The patent changes the particle diameter parameter in the cover layer to compensate for the reduced thickness. By establishing specific ratio ranges (Dc1/Dc2: 1.11-2.91, Dc1/Dc3: 1.13-4.88), the manufacturing process can achieve consistent quality even with thinner dielectric layers, enabling higher lamination counts while maintaining structural integrity.
3Volume of moving object
If the cover layer thickness is reduced to enable miniaturization, then the component size is reduced, but the lifespan is shortened due to poor humidity resistance
Solution Approach 1:
The patent creates a protective structure with local quality variation in the cover layer. The outermost part with larger particles (Dc1) forms a more robust barrier against humidity, while the intermediate part (Dc2) provides structural support. This localized differentiation extends the component lifespan despite the overall thin structure required for miniaturization.
Solution Approach 2:
The cover layer functions as a composite structure with two distinct particle size regions. This composite approach combines the benefits of larger particles (humidity resistance) and smaller particles (structural integrity) within a thin layer, achieving both miniaturization and extended lifespan.
Data Source
AI summary
There are provided a laminated ceramic electronic component and a method of fabricating the same. The laminated ceramic electronic component include a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein the ceramic body includes an active layer that is a capacitance forming part and a cover layer that is a non-capacitance forming part formed on at least one of a top surface and a bottom surface of the active layer, and when a thickness of the ceramic body is t and a thickness of the cover layer is T, T≦t×0.05 is satisfied and when an average particle diameter of a dielectric grain in the active layer is Da and an average particle diameter of a dielectric grain in the cover layer is Dc, 0.7≦Dc/Da≦1.5 is satisfied.