Ceramic Electronic Component Crack Prevention Design
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Solution Overview
Problem
Thin and small ceramic electronic components are prone to cracking and short circuits due to reduced strength, especially when mounted on circuit boards, as existing techniques fail to adequately prevent short circuits between internal electrodes despite attempts to minimize thickness.
Innovation Solution
A ceramic electronic component design with internal electrodes arranged to avoid short circuits, where the first and second internal electrodes are positioned in the central portion of the ceramic body and not in the end portions, and external electrodes are strategically placed to minimize stress and prevent cracks from extending to the internal electrodes, adhering to specific width and thickness ratios.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the ceramic body thickness is reduced to make the component thinner, then the component size is improved, but the strength decreases and cracks occur more easily
Solution Approach 1:
The patent applies local quality by creating a protective ceramic layer specifically at the end portions of the ceramic body where cracks are most likely to occur. This protective layer has different properties (higher strength, different thermal expansion coefficient) than the main ceramic body, providing localized reinforcement exactly where needed without increasing the overall thickness of the component.
2Ease of operation
If the ceramic body thickness is reduced, then the component can be embedded more easily into circuit boards, but short circuits between internal electrodes cannot be sufficiently prevented
Solution Approach 1:
The patent applies preliminary action by forming the protective ceramic layer at the end portions of the ceramic body before the component is mounted onto the circuit board. This pre-formed protective structure is designed to prevent cracks from developing during the subsequent mounting process, thereby preventing short circuits between internal electrodes before they can occur.
3Reliability
If external electrodes are provided on side surfaces, then electrical connection is improved, but stress concentration occurs and cracks are more likely to form
Solution Approach 1:
The patent applies the taking out principle by removing external electrodes from the vulnerable side surfaces of the ceramic body and relocating them to the end surfaces. This extraction of electrodes from high-stress areas eliminates the stress concentration that would occur at electrode-ceramic interfaces on side surfaces, while maintaining electrical connectivity through the relocated electrodes on the end surfaces.
Data Source
AI summary
A ceramic electronic component includes a ceramic body having a substantially rectangular parallelpiped shape. The ceramic body includes a central portion in which first and second internal electrodes are arranged, and first and second end portions in which the first and second internal electrodes are not arranged. The ceramic electronic component satisfies Expressions (1) and (2) below:W1>T (1)W2>T (2)where T denotes the dimension of the ceramic body in a thickness direction, W1 denotes the dimension of the first end portion in a width direction, and W2 denotes the dimension of the second end portion in the width direction.