Laminated Ceramic Component Crack Resistance via Protective Area Geometry

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Solution Overview

Problem

Laminated ceramic electronic components often experience cracks extending from the upper or lower face to the right or left side face due to increased volume occupancy of internal electrodes and ceramic layers, which is exacerbated by miniaturization and capacity increases, leading to decreased strength and potential failure.

Innovation Solution

A laminated ceramic electronic component design featuring a functional area with conductive layers and ceramic layers, surrounded by a protective area with a ring-like cross-section, where the ratio of the protective area's wall thickness in the vertical direction to its wall thickness in the transverse direction is optimized to 0 < t/Wg ≤ 0.80, and preferably ≤ 0.57, to enhance structural integrity without compromising miniaturization or capacity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the volume occupancy of internal electrodes and ceramic layers is increased to achieve miniaturization and capacity increase, then the capacity and miniaturization are improved, but cracks occur extending from upper or lower face to side face

Engineering Contradiction:

Improvecapacity increaseVSAvoidcrack occurrence

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The protective area is designed with specific dimensional relationships (t/Wg ratio between 0.24 and 0.80) to create different structural properties in different regions. This local structural optimization provides enhanced crack resistance at critical locations without compromising the overall miniaturization and capacity increase of the component.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The protective area acts as a preventive structure that cushions against crack formation before cracks can develop. By maintaining the specified dimensional ratios in the protective area, the structure preemptively prevents crack propagation from the functional area, addressing the reliability issue before it manifests.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Strength

If the protective area wall thickness is increased to prevent cracks, then the structural integrity is improved, but the miniaturization is compromised

Engineering Contradiction:

Improvestructural integrityVSAvoidminiaturization

Core Design Contradiction:

StrengthVSVolume of moving object

Solution Approach 1:

The invention optimizes the dimensional parameters of the protective area, specifically the ratio t/Wg between 0.24 and 0.80, to achieve the minimum required structural integrity. This parameter optimization ensures adequate crack resistance while maintaining the smallest possible volume for the protective area, thus enabling miniaturization without sacrificing strength.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS7324325B2Laminated ceramic electronic component

Publication Date: 2008.01.29 TDK CORP

AI summary

A laminated ceramic electronic component has a plurality of conductive layers embedded in a ceramic substrate. The laminated ceramic electronic component includes: a functional area composed of the plurality of conductive layers and ceramic layers interposed therebetween; and a protective area formed around the functional area to have a ring-like cross section. The laminated ceramic electronic component satisfies the following condition:0<t/Wg≦0.80,where t represents a wall thickness of the protective area in a vertical direction, and Wg represents a wall thickness of the protective area in a transverse direction.