Monolithic Ceramic Component Dummy Conductor Density
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Solution Overview
Problem
The reliability of monolithic ceramic electronic components, particularly breakdown voltage (BDV), degrades due to the presence of dummy conductors which cause excessive pressing of inner electrodes during the firing process, leading to local shortening of electrode distances and accuracy issues in forming outer electrodes at narrow pitches.
Innovation Solution
The design includes a reduced density of outer-layer dummy conductors in the outer layer portion, with specific intervals (d1) between them, to prevent excessive pressing of inner electrodes while ensuring reliable growth of plated films, where d1 is set to satisfy 1.7d2 ≤ d1 ≤ 6 μm to balance reliability and film growth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dummy conductors are present in the outer layer portion to ensure reliable plated metal growth, then plated film growth is improved, but the inner electrodes are excessively pressed during firing causing local shortening of electrode distances and reliability degradation
Solution Approach 1:
The patent removes dummy conductors from the outer layer portion where no inner electrodes are present, extracting only the harmful element while retaining the beneficial plated film growth on actual inner electrodes
Solution Approach 2:
The patent applies different structural qualities to different regions: dummy conductors are present in inner layer portions where they support plated film growth without harming inner electrodes, but absent in outer layer portions where they would cause excessive pressing and electrode distance shortening
2Volume of moving object
If the size of the monolithic ceramic electronic component is reduced, then device size is improved, but the effective area where inner electrodes are opposed to each other is reduced causing characteristic degradation
Solution Approach 1:
The patent changes the structural parameters by eliminating dummy conductors in outer layer portions, which prevents local shortening of electrode distances and maintains the effective area of inner electrodes even in miniaturized components
3Manufacturing precision
If outer electrodes are formed directly by plating to achieve thin and flat electrodes, then manufacturing precision of outer electrodes is improved, but dummy conductors cause excessive pressing of inner electrodes during firing
Solution Approach 1:
The patent extracts dummy conductors from outer layer portions to eliminate the harmful pressing effect on inner electrodes, while maintaining the direct plating method for forming outer electrodes on exposed inner electrode portions
Solution Approach 2:
The patent creates a localized structure where dummy conductors are present only in inner layer portions for plating support, but absent in outer layer portions to prevent interference with inner electrode positioning and maintain breakdown voltage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the degradation of reliability and breakdown voltage by preventing local shortening of electrode distances while ensuring continuous growth of plated films, enhancing the accuracy and performance of monolithic ceramic electronic components.
Implementation Method 1
a first outer electrode disposed on the lateral surface of the ceramic base element and including a plated film that directly covers an exposed portion of the first lead-out portion
Data Source
AI summary
In a monolithic ceramic electronic component, given that an interval between outer-layer dummy conductors adjacent to each other in an outer layer portion is d1, and that an interval between first and second inner electrodes adjacent to each other in an inner layer portion is d2, 1.7d2≦d1 is satisfied. By reducing a density of the outer-layer dummy conductors in the outer layer portion on that condition, pressing of the inner electrodes through the outer-layer dummy conductors is relieved in a pressing step before firing. As a result, a distance between the inner electrodes can be prevented from being locally shortened. It is hence possible to effectively reduce and prevent degradation of reliability of the monolithic ceramic electronic component, e.g., a reduction of BDV.