Multilayer Ceramic Component Dummy Electrode Delamination
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Solution Overview
Problem
The increasing thickness reduction of multilayer ceramic electronic components in IT products has led to a heightened importance on strength and a growing issue of delamination, which existing technologies have not adequately addressed.
Innovation Solution
A multilayer ceramic electronic component design that includes a ceramic body with dielectric layers and internal electrodes, external electrodes, and a protective layer featuring dummy electrodes stacked with a thickness greater than the length of each dummy electrode cell, enhancing durability and preventing delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the multilayer ceramic electronic component is reduced to meet thinning requirements of IT products, then the component size is reduced, but the strength and reliability deteriorate and delamination occurs
Solution Approach 1:
The protective layer is segmented into multiple dummy electrode cells stacked in the thickness direction, with each cell containing dummy electrodes. This segmentation allows the protective layer to distribute mechanical stress across multiple layers, preventing delamination while maintaining overall component strength in thin-profile designs
Solution Approach 2:
The protective layer extends beyond the electrode region in the planar direction, creating an overhang structure. This dimensional extension provides mechanical support to the thin ceramic body at the edges, preventing delamination without increasing the overall thickness of the functional layers
2Length of moving object
If the thickness of the multilayer ceramic electronic component is reduced, then the component size is reduced, but delamination occurs
Solution Approach 1:
The protective layer with dummy electrode cells is positioned beforehand at locations prone to delamination (edge regions and areas above electrodes). This pre-positioned protective structure cushions against mechanical stresses and thermal expansion differences before delamination can occur, maintaining reliability in thin components
Solution Approach 2:
The protective layer combines dummy electrodes with dielectric material to create a composite structure that provides both electrical shielding and mechanical reinforcement. This composite construction enhances delamination resistance through the combined properties of conductive and insulating materials in a thin-profile configuration
Data Source
AI summary
A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes stacked to be alternately exposed to first and second outer surfaces with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second outer surfaces of the ceramic body to be electrically connected to the first and second internal electrodes, respectively. The ceramic body further includes a protective layer disposed on at least one of upper and lower portions of the first and second internal electrodes, the protective layer includes a plurality of dummy electrode cells each having the plurality of dummy electrodes stacked thereon, and a thickness from the uppermost dummy electrode to the lowermost dummy electrode of each of the plurality of dummy electrode cells is greater than a length of each of the plurality of dummy electrode cells.