Monolithic Ceramic Component Dummy Electrode Spacing
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Solution Overview
Problem
The reliability of monolithic ceramic electronic components, particularly in smaller sizes, is compromised due to the presence of dummy conductors which cause excessive pressing of inner electrodes during the firing process, leading to reduced breakdown voltage and accuracy issues in forming outer electrodes at narrow pitches.
Innovation Solution
The use of outer-layer dummy conductors arranged at specific intervals to prevent excessive pressing of inner electrodes, ensuring reliable plating deposition while maintaining a sufficient interval to allow continuous film growth, with the interval between adjacent outer-layer dummy groups set to be no greater than 6 μm to balance reliability and film growth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If component size is reduced to meet miniaturization demands, then device size is decreased, but effective area of inner electrodes is reduced causing characteristic degradation
Solution Approach 1:
The dummy conductors are positioned in the outer layer portion at intervals that extend in multiple dimensions, allowing plating deposition to occur in a distributed pattern that maximizes use of available space without compromising the effective area of inner electrodes for capacitance formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of monolithic ceramic electronic components by preventing local shortening of inner electrode distances and ensuring continuous plating film growth, thereby improving breakdown voltage and accuracy of outer electrode formation.
Implementation Method 1
a first outer electrode disposed on the outer surface of the ceramic base element and including a plated film that directly covers an exposed portion of the first lead-out portion
Data Source
AI summary
Two or more outer-layer dummy conductors are successively arranged at predetermined intervals in the height direction, thereby forming a plurality of outer-layer dummy groups. Given that an interval between the adjacent outer-layer dummy conductors within each of the outer-layer dummy groups is d and an interval between the adjacent outer-layer dummy groups is g, g is greater than d. On that condition, the outer-layer dummy groups can be positioned satisfactorily apart away from each other, while plating deposition points are ensured. As a result, pressing of inner electrodes through the outer-layer dummy conductors can be relieved, whereby the distance between the inner electrodes can be prevented from being locally shortened and a reduction of BDV can be prevented.