Multilayer Ceramic Component External Electrode Plating Infiltration

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Solution Overview

Problem

Multilayer ceramic electronic components face reliability issues due to infiltration of plating solutions through thinned external electrodes, especially when low temperature glass powder is used for hermetic sealing, as it can lead to degradation and insufficient sealing.

Innovation Solution

The implementation of a multilayer ceramic electronic component design featuring first and second external electrodes with protective layers, including oxide and glass layers, formed between them to prevent plating solution infiltration, where the oxide layer can be copper oxide and the conductive metals used are copper, nickel, silver, or silver-palladium, with thermal treatment within a specific temperature range to enhance hermetic sealing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If external electrodes are thinned to reduce component size, then productivity and size reduction are improved, but plating solution infiltration increases causing reliability degradation

Engineering Contradiction:

Improvecomponent size reductionVSAvoidplating solution infiltration prevention

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The external electrode structure is segmented into multiple functional layers: a base external electrode layer, an intermediate protective layer containing glass powder and metal oxide, and an upper external electrode layer. This segmentation allows each layer to perform its specific function - the base layer provides electrical connection, the intermediate layer provides hermetic sealing, and the upper layer provides additional electrical functionality, thereby preventing plating solution infiltration while maintaining thin overall thickness

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

An intermediate protective layer is introduced between the base external electrode and the upper external electrode. This intermediate layer acts as a mediator that provides hermetic sealing to prevent plating solution from infiltrating through the thinned external electrode structure, while still allowing the external electrodes to maintain their electrical connection functions

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If low temperature glass powder is used to enhance hermetic sealing, then reliability is improved, but acid resistance deteriorates causing glass dissolution

Engineering Contradiction:

Improvehermetic sealingVSAvoidglass powder acid resistance

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The intermediate protective layer is formulated as a composite material containing both glass powder (for hermetic sealing) and metal oxide particles (for acid resistance). This composite structure allows the glass powder to provide low-temperature sealing while the metal oxide particles reinforce the structure against acid dissolution from plated layers, thereby simultaneously achieving both hermetic sealing and acid resistance

Inventive Principle:

Principle #40Composite materials

3Volume of moving object

If external electrode thickness is reduced, then component size is reduced, but hermetic sealing capability deteriorates

Engineering Contradiction:

Improvecomponent sizeVSAvoidhermetic sealing capability

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The external electrode system is segmented into multiple thin layers rather than using a single thick layer. The intermediate protective layer is positioned between upper and lower external electrode layers, creating a multi-layered structure that achieves hermetic sealing without requiring increased overall thickness, thus maintaining small component size while improving sealing capability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively prevents plating solution infiltration, ensuring high reliability and hermetic sealing even with thinned external electrodes, thereby maintaining component performance and stability.

Implementation Method 1

low temperature glass powder and fine copper powder that enhance hermetic sealing of the external electrodes

Methodology Applied

Scientific EffectHermetic sealing:

Implementation Method 2

the oxide layer may include copper oxide (CuO)

Methodology Applied

Scientific EffectOxidation: Oxidation

Implementation Method 3

thermal treatment within a specific temperature range to enhance hermetic sealing

Methodology Applied

Scientific EffectThermal treatment: Heat Treatment

Implementation Method 4

thermally treating the ceramic main body to form protective layers including oxide layers on the first external electrodes

Methodology Applied

Scientific EffectOxidation: Oxidation

Data Source

PatentUS8982534B2Multilayer ceramic electronic component and method of manufacturing the same

Publication Date: 2015.03.17 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

There is provided a multilayer ceramic electronic component including: a ceramic main body including a dielectric layer and internal electrodes disposed to face each other, while having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein the external electrodes include first external electrodes formed on outer surfaces of the ceramic main body and second external electrodes formed outwardly of the first external electrodes, and protective layers including one or more of an oxide layer and a glass layer are formed between the first external electrodes and the second external electrodes.