Multilayer Ceramic Component External Electrode Thickness Control
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Solution Overview
Problem
Multilayer ceramic electronic components face challenges in reducing size while maintaining high capacitance and reliability due to non-uniform thickness of external electrodes, which can lead to plating solution infiltration and reliability issues.
Innovation Solution
The solution involves forming external electrodes with an average thickness of 10 μm or less, ensuring a thickness ratio of 0.5≦|T1/Tc|≦1.0 and |T2/Tc|≦1.0, and a distance ratio |Tc−T1|/L≦0.02, using a conductive metal composition of 60 wt % or less, including copper, nickel, silver, or silver-palladium, to minimize thickness deviations and enhance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If external electrodes are thinned to reduce component size, then the capacitance density is improved, but the reliability deteriorates due to plating solution infiltration through thinner portions
Solution Approach 1:
The patent applies local quality by creating a non-uniform external electrode thickness distribution where the central portion has a specific thickness Tc and the lateral edge has thickness T1 satisfying 0.5≦|T1/Tc|≦1.0. This localized thickness variation ensures that even though the overall electrode is thinned for small size, the critical regions maintain sufficient thickness to prevent plating solution infiltration, thus resolving the contradiction between size reduction and reliability maintenance
2Volume of moving object
If external electrode thickness is reduced uniformly, then the component size is reduced, but the manufacturing precision deteriorates due to difficulty in controlling uniform thickness
Solution Approach 1:
The patent applies parameter changes by defining specific thickness ratio parameters (|T1/Tc| between 0.5 and 1.0, and |T2/Tc| between 0.2 and 1.0) that provide clear manufacturing targets. These parameter specifications enable precise control of the electrode thickness distribution during fabrication, making it easier to achieve the desired non-uniform thickness profile while maintaining manufacturing precision
3Quantity of substance
If external electrodes are thinned to increase capacitance density, then the capacitance per volume is improved, but the reliability deteriorates due to increased infiltration risk at thinner regions
Solution Approach 1:
The patent applies local quality by creating a non-uniform external electrode thickness distribution where the central portion has a specific thickness Tc and the lateral edge has thickness T1 satisfying 0.5≦|T1/Tc|≦1.0. This localized thickness variation ensures that even though the overall electrode is thinned for small size, the critical regions maintain sufficient thickness to prevent plating solution infiltration, thus resolving the contradiction between size reduction and reliability maintenance
Data Source
AI summary
A multilayer ceramic electronic component includes: a ceramic main body; a plurality of internal electrodes laminated within the ceramic main body; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a width direction is Tc and a thickness of the external electrodes at a lateral edge of a printed surface region of the internal electrodes is T1, 0.5≦|T1/Tc|≦1.0 is satisfied.